74AXP1G17GM: Low-power Schmitt trigger

The 74AXP1G17 is a single Schmitt trigger buffer. It can transform slowly changing input signals into sharply defined, jitter-free output signals.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

74AXP1G17GM: 产品结构框图
Outline 3d SOT886
数据手册 (1)
名称/描述Modified Date
Low-power Schmitt trigger (REV 1.0) PDF (191.0 kB) 74AXP1G17 [English]06 Oct 2014
选型工具指南 (2)
名称/描述Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
封装信息 (1)
名称/描述Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
IBIS
订购信息
型号状态FamilyVCC (V)功能Logic switching levels说明Package versionOutput drive capability (mA)tpd (ns)fmax (MHz)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pins
74AXP1G17GMActiveAXP0.7 - 2.75Schmitt-triggersCMOSLow-power Schmitt triggerSOT886+/- 4.52.8701ultra low-40~853228.3164XSON66
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
74AXP1G17GMSOT886Reflow_Soldering_ProfileReel 7" Q3/T4, ReverseActive74AXP1G17GMH (9353 041 02125)Standard Marking74AXP1G17GMAlways Pb-free11
Low-power Schmitt trigger 74AXP1G17GX
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT886 Topmark prtr5v0u2f
74AXP1G17 IBIS model 74AXP1G17GX
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
74AVCM162836DGG
BGU8007