74AXP1G97：Low-power configurable multiple function gate _ BDTIC 中国领先电子元器件代理商

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74AXP1G97：Low-power configurable multiple function gate

The 74AXP1G97 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer. All inputs can be connected directly to VCC or GND.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性和优势

Wide supply voltage range from 0.7 V to 2.75 V
Low input capacitance; CI = 0.5 pF (typical)
Low output capacitance; CO = 1.0 pF (typical)
Low dynamic power consumption; CPD = 2.6 pF at VCC = 1.2 V (typical)
Low static power consumption; ICC = 0.6 μA (85 °C maximum)
High noise immunity
Complies with JEDEC standard:
- JESD8-12A.01 (1.1 V to 1.3 V)
- JESD8-11A.01 (1.4 V to 1.6 V)
- JESD8-7A (1.65 V to 1.95 V)
- JESD8-5A.01 (2.3 V to 2.7 V)
JESD8-12A.01 (1.1 V to 1.3 V)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
ESD protection:
- HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
- CDM JESD22-C101E exceeds 1000 V
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial power-down mode operation
Multiple package options
Specified from ‑40 °C to +85 °C

产品图片

关键参数

型号	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	No of bits	Power dissipation considerations	T_amb (Cel)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74AXP1G97GM	Production	0.7 - 2.75	CMOS	4.5/-4.5	4.5	70	1	ultra low	-40~85	322	8.3	164	XSON6
74AXP1G97GN	Production	0.7 - 2.75	CMOS	4.5/-4.5	4.5	70	1	ultra low	-40~85	366	28.6	226	XSON6
74AXP1G97GS	Production	0.7 - 2.75	CMOS	4.5/-4.5	4.5	70	1	ultra low	-40~85	347	36.3	235	XSON6

封装与包装

型号	封装	Outline version	Reflow-/Wave soldering	包装	产品状态	标示	可订购的器件编号, (订购码 (12NC))
74AXP1G97GM	XSON6 (SOT886)	sot886_po	sot886_fr	Reel 7" Q3/T4, Reverse	量产	Standard Marking	74AXP1G97GMH( 9353 016 03125 )
74AXP1G97GN	XSON6 (SOT1115)	sot1115_po		Reel 7" Q3/T4, Reverse	量产	Standard Marking	74AXP1G97GNH( 9353 016 04125 )
74AXP1G97GS	XSON6 (SOT1202)	sot1202_po	sot1202_fr	Reel 7" Q3/T4, Reverse	量产	Standard Marking	74AXP1G97GSH( 9353 016 05125 )

无铅环保信息

型号	可订购的器件编号	无铅转换日期	潮湿敏感度等级	MSL LF
74AXP1G97GM	74AXP1G97GMH	Always Pb-free	1	1
74AXP1G97GN	74AXP1G97GNH	Always Pb-free	1	1
74AXP1G97GS	74AXP1G97GSH	Always Pb-free	1	1

文档资料

档案名称	标题	类型	格式	日期
74AXP1G97 (中文)	Low-power configurable multiple function gate	Data sheet	pdf	2014-09-03
sot886_po	plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm	Outline drawing	pdf	2004-07-21
sot886_fr	Footprint for reflow soldering SOT886	Reflow soldering	pdf	2010-07-13
SOT886_132	XSON6; reel pack; standard product orientation; 12NC ending 132	Packing	pdf	2012-11-28
Reflow_Soldering_Profile	Reflow Soldering Profile	Reflow soldering	pdf	2013-09-30
SOT886_115	XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code (12NC) ending 115	Packing	pdf	2013-04-23
sot1202_po	extremely thin small outline package; no leads; 6 terminals	Outline drawing	pdf	2010-04-07
SOT1202_132	Reversed product orientation 12NC ending 132	Packing	pdf	2013-04-04
sot1202_fr	sot1202_fr	Reflow soldering	pdf	2014-01-28
SOT1115_132	Reversed product orientation 12NC ending 132	Packing	pdf	2013-04-04
sot1115_po	extremely thin small outline package; no leads; 6 terminals	Outline drawing	pdf	2010-04-22