74AXP2G07: Low-power dual buffer with open-drain output

The 74AXP2G07 is a dual non-inverting buffer with open-drain outputs.

Schmitt-trigger action at the inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Outline 3d SOT886
数据手册 (1)
名称/描述Modified Date
Low-power dual buffer with open-drain output (REV 2.0) PDF (187.0 kB) 74AXP2G07 [English]16 Sep 2015
选型工具指南 (2)
名称/描述Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
封装信息 (4)
名称/描述Modified Date
plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.35 mm (REV 1.1) PDF (217.0 kB) SOT1255 [English]22 Apr 2016
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
X2SON6; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 3.0) PDF (202.0 kB) SOT1255_147 [English]20 Oct 2016
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
IBIS
订购信息
型号状态
74AXP2G07GXActive
74AXP2G07GNActive
74AXP2G07GMActive
74AXP2G07GSActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
74AXP2G07GXSOT1255Reel 7" Q2/T3Active74AXP2G07GXZ (9353 071 32147)Standard Marking74AXP2G07GXAlways Pb-free11
74AXP2G07GSSOT1202Reel 7" Q3/T4, ReverseActive74AXP2G07GSH (9353 040 94125)Standard Marking74AXP2G07GSAlways Pb-free11
74AXP2G07GMSOT886Reflow_Soldering_ProfileReel 7" Q3/T4, ReverseActive74AXP2G07GMH (9353 040 92125)Standard Marking74AXP2G07GMAlways Pb-free11
74AXP2G07GNSOT1115Reel 7" Q3/T4, ReverseActive74AXP2G07GNH (9353 040 93125)Standard Marking74AXP2G07GNAlways Pb-free11
Low-power dual buffer with open-drain output 74AXP2G07GX
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT1115 Topmark 74AUP1G332
MAR_SOT1202 Topmark NCX2200GS
MAR_SOT886 Topmark prtr5v0u2f
74AXP2G07 IBIS model 74AXP2G07GS
SOT1255 74AUP1G3208
Reel 7" Q2/T3 74AUP1G3208
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
SOT1115 74AUP1G332
74LVC2G17
BGU8007
74LVC2G17