74LV165: 8位串行输入/并行输出移位寄存器

74LV165是8位并行负载或串行输入移位寄存器,末级提供互补串行输出(Q7和Q7)。并行负载(PL)输入为低电平时,来自D0至D7输入的并行数据会异步加载到寄存器中。输入PL为高电平时,数据在输入DS处串行输入寄存器。其随每次时钟正向跃迁向右移一位(Q0 → Q1 → Q2,以此类推)。通过将Q7输出连接到后一级的DS输入,该特性可实现并行到串行转换器扩展。

时钟输入为门控或结构,允许一个输入用作低电平有效时钟使能输入(CE)输入。CP和CE输入的针脚分配是任意的,为方便布局可颠倒。CE输入从低电平至高电平的跃迁应当仅在CP为高电平时发生,以便操作可预测。PL从低电平跃迁到高电平前CP或CE应当为高电平,以防激活PL时移位数据。

74LV165: 产品结构框图
sot109-1_3d
数据手册 (1)
名称/描述Modified Date
8-bit parallel-in/serial-out shift register (REV 7.0) PDF (211.0 kB) 74LV165 [English]09 Mar 2016
应用说明 (1)
名称/描述Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
手册 (2)
名称/描述Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]16 Feb 2015
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]20 May 2014
封装信息 (3)
名称/描述Modified Date
plastic small outline package; 16 leads; body width 3.9 mm (REV 1.0) PDF (192.0 kB) SOT109-1 [English]08 Feb 2016
plastic shrink small outline package; 16 leads; body width 5.3 mm (REV 1.0) PDF (306.0 kB) SOT338-1 [English]08 Feb 2016
plastic thin shrink small outline package; 16 leads; body width 4.4 mm (REV 1.0) PDF (300.0 kB) SOT403-1 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
SO16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 4.0) PDF (210.0 kB) SOT109-1_118 [English]24 Apr 2013
TSSOP16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (218.0 kB) SOT403-1_118 [English]08 Apr 2013
支持信息 (4)
名称/描述Modified Date
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
Footprint for reflow soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]08 Oct 2009
订购信息
型号状态
74LV165DActive
74LV165PWActive
74LV165DBActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74LV165DBSOT338-1SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE
SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1Active74LV165DB,118 (9351 660 30118)LV16574LV165DBweek 12, 2005144.910.239.78E711
Bulk PackActive74LV165DB,112 (9351 660 30112)LV16574LV165DBweek 12, 2005144.910.239.78E711
74LV165PWSOT403-1SSOP-TSSOP-VSO-WAVEReel 13" Q1/T1Active74LV165PW,118 (9351 745 40118)LV16574LV165PWweek 17, 2005144.910.239.78E711
Bulk PackActive74LV165PW,112 (9351 745 40112)LV16574LV165PWweek 17, 2005144.910.239.78E711
74LV165DSOT109-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1Active74LV165D,118 (9351 560 60118)74LV165D74LV165Dweek 6, 2004144.910.239.78E711
Bulk PackActive74LV165D,112 (9351 560 60112)74LV165D74LV165Dweek 6, 2004144.910.239.78E711
8-bit parallel-in/serial-out shift register 74LV165PW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
電圧レベルシフタ 74AVC16245DGG-Q100
Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
plastic shrink small outline package; 16 leads; body width 5.3 mm 74HC_T_595_Q100
Footprint for reflow soldering 74HC_T_595_Q100
SOT403-1 LPC812M101JDH16
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
Reel 13" Q1/T1 LPC812M101JDH16
plastic small outline package; 16 leads; body width 3.9 mm NPIC6C596A_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
SO16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... NPIC6C596A_Q100
74LV165
HEF4094B
PCA9633
SA614A