BAS16LD: 单个高速开关二极管
单个高速开关二极管，采用SOD882D超小型无引脚表面贴装设备(SMD)塑料封装，具有可见且可焊的侧焊盘。
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数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Single high-speed switching diode (REV 1.0) PDF (248.0 kB) BAS16LD [English] | 18 Oct 2010 |
手册 (2)
| 名称/描述 | Modified Date |
|---|---|
| NXP® SOD882D package, First leadless package with tin-plated, solderable side pads (REV 2.0) PDF (1.8 MB) 75017130 [English] | 06 Jun 2011 |
| The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D [English] | 21 Oct 2010 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D [English] | 08 Feb 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS16LD NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS16LD_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS16LD NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS16LD_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BAS16L SPICE model (REV 2.4) TXT BAS16L 7/22/2012
- BAS16LD SPICE model (REV 1.1) prm BAS16LD_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR [max] (V) | VR max (V) | IFSM max (A) | IFSM [max] (A) | VFmax (mV) | VF [max] (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF [max] (mA) | IF max (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS16LD | Active | SOD882D | DFN1006D-2 | 1 x 0.6 x 0.4 | 100 | 100 | 4 | 4 | 1000@IF=50mA | 1000@IF=50mA | 500@VR=80V | 500@VR=80V | 500 | 500 | single | 4 | 4 | 215 | 215 | 1.5 | 1.5 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS16LD | | SOD882D | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAS16LD,315 (9340 645 65315) | 1000 0000 | BAS16LD |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- NXP® SOD882D package, First leadless package with tin-plated, solderable side pads pesd5v0s1uld
- The first leadless package with solderable side pads pesd5v0s1uld
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS16LD NXP Product Quality BAS16LD
- BAS16LD NXP® Product Reliability BAS16LD
- BAS16L SPICE model BAS16LD
- BAS16LD SPICE model BAS16LD
- DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- BB187LX
