BAS19: 通用二极管

BAS19、BAS20和BAS21是采用平面技术制造的通用二极管,配以小型SOT23 SMD塑料封装。

BAS19: 产品结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
General purpose diodes (REV 4.0) PDF (128.0 kB) BAS19_20_21 [English]20 Mar 2003
手册 (1)
名称/描述Modified Date
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English]01 Jun 2008
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BAS19 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS19_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAS19 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS19_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
订购信息
型号状态Package versionPackage name大小 (mm)VR max (V)VR [max] (V)IFSM max (A)IFSM [max] (A)VF [max] (mV)VFmax (mV)IR max (nA)IR [max] (nA)IFRM (mA)IFRM (mA)Configurationtrr [max] (ns)trr max (ns)IF [max] (mA)IF max (mA)Cd [max] (pF)Cd max. (pF)
BAS19ActiveSOT23TO-236AB2.9 x 1.3 x 1100100991000@IF=100mA1000@IF=100mA100@VR=100V100@VR=100V625625single505020020055
BAS19/GNo Longer ManufacturedSOT23TO-236AB2.9 x 1.3 x 1100100991000@IF=100mA1000@IF=100mA100@VR=100V100@VR=100V625625single505020020055
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAS19SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBAS19,215 (9335 020 20215)JP%BAS19week 34, 2003347.01.616.21E811
Reel 11" Q3/T4, LargePackActiveBAS19,235 (9335 020 20235)JP%BAS19week 34, 2003347.01.616.21E811
General purpose diodes BAS21
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
BAS19 NXP Product Quality BAS19
BAS19 NXP® Product Reliability BAS19
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
BAS17
PMBFJ309