BAS19、BAS20和BAS21是采用平面技术制造的通用二极管,配以小型SOT23 SMD塑料封装。
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General purpose diodes (REV 4.0) PDF (128.0 kB) BAS19_20_21 [English] | 20 Mar 2003 |
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Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English] | 01 Jun 2008 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English] | 16 Nov 2012 |
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
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BAS19 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS19_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
BAS19 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS19_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
型号 | 状态 | Package version | Package name | 大小 (mm) | VR max (V) | VR [max] (V) | IFSM max (A) | IFSM [max] (A) | VF [max] (mV) | VFmax (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF [max] (mA) | IF max (mA) | Cd [max] (pF) | Cd max. (pF) |
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BAS19 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 100 | 100 | 9 | 9 | 1000@IF=100mA | 1000@IF=100mA | 100@VR=100V | 100@VR=100V | 625 | 625 | single | 50 | 50 | 200 | 200 | 5 | 5 |
BAS19/G | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 100 | 100 | 9 | 9 | 1000@IF=100mA | 1000@IF=100mA | 100@VR=100V | 100@VR=100V | 625 | 625 | single | 50 | 50 | 200 | 200 | 5 | 5 |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
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BAS19 | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BAS19,215 (9335 020 20215) | JP% | BAS19 | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 | ||
Reel 11" Q3/T4, LargePack | Active | BAS19,235 (9335 020 20235) | JP% | BAS19 | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |