BAS29; BAS31; BAS35: (两个)通用受控雪崩二极管

通用开关二极管采用平面技术制造,配以小型矩形SMD SOT23塑料封装。BAS29由一个单个二极管组成。BAS31具有两个串联二极管。BAS35具有两个共阳极二极管。

BAS29_BAS31_BAS35: 产品结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
General purpose controlled avalanche (double) diodes (REV 5.0) PDF (132.0 kB) BAS29_31_35 [English]20 Mar 2003
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (6)
名称/描述Modified Date
BAS29 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS29_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAS29 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS29_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BAS31 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS31_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAS31 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS31_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BAS35 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS35_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAS35 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS35_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
订购信息
型号状态
BAS29Active
BAS35Active
BAS31Active
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAS29SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBAS29,215 (9337 231 80215)%A8BAS29week 34, 2003347.01.616.21E811
BAS31SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBAS31,235 (9337 231 90235)%V1BAS31week 34, 2003347.01.616.21E811
Reel 7" Q3/T4ActiveBAS31,215 (9337 231 90215)%V1BAS31week 34, 2003347.01.616.21E811
BAS35SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBAS35,215 (9337 232 00215)%V2BAS35week 34, 2003347.01.616.21E811
General purpose controlled avalanche (double) diodes BAS35
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAS29 NXP Product Quality BAS29
BAS29 NXP® Product Reliability BAS29
BAS31 NXP Product Quality BAS31
BAS31 NXP® Product Reliability BAS31
BAS35 NXP Product Quality BAS35
BAS35 NXP® Product Reliability BAS35
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
BAS29_BAS31_BAS35
PMBFJ309