BAS40-06: 通用肖特基二极管
通用肖特基二极管采用小型表面贴装器件（SMD）塑料封装。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| General-purpose Schottky diodes (REV 9.0) PDF (342.0 kB) BAS40_1PSXXSB4X_SER [English] | 18 Mar 2015 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS40-06 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS40-06_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS40-06 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAS40-06_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BAS40-06 SPICE model (REV 1.4) prm BAS40-06 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS40-06 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 1@VR=30V | dual c.a. | 500@IF=10mA | 0.2 | 5@VR=0V | 0.01@VR=40V | 40 | 120 | ||
| BAS40-06/A2 | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 1@VR=30V | dual c.a. | 500@IF=10mA | 0.2 | 5@VR=0V | 0.01@VR=40V | 40 | 120 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS40-06 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BAS40-06,235 (9340 345 50235) | 46% | BAS40-06 |    | week 34, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BAS40-06,215 (9340 345 50215) | 46% | BAS40-06 | | week 34, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- General-purpose Schottky diodes BAS40XY
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS40-06 NXP Product Quality BAS40-06
- BAS40-06 NXP® Product Reliability BAS40-06
- BAS40-06 SPICE model BAS40-06
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
