BAS521: 单个高压开关二极管
单个高压开关二极管，采用平面技术制造，配以SOD523 (SC-79)超小型表面贴装设备（SMD）塑料封装。
BAS521: 产品结构框图
sod523_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Single high-voltage switching diode (REV 2.0) PDF (110.0 kB) BAS521 [English] | 11 Nov 2010 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English] | 08 Feb 2016 |
包装 (3)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English] | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 135 (REV 1.0) PDF (179.0 kB) SOD523_135 [English] | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 315 (REV 1.0) PDF (179.0 kB) SOD523_315 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS521 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS521_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS521 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS521_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BAS521 SPICE model (REV 1.0) TXT BAS521_1 1/22/2014
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR [max] (V) | VR max (V) | IFSM max (A) | IFSM [max] (A) | VFmax (mV) | VF [max] (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF [max] (mA) | IF max (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS521 | Active | SOD523 | SOD523 | 1.2 x 0.8 x 0.6 | 300 | 300 | 4.5 | 4.5 | 1100@IF=100mA | 1100@IF=100mA | 150@VR=250V | 150@VR=250V | 1000 | 1000 | single | 50 | 50 | 250 | 250 | 5 | 5 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS521 | | SOD523 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BAS521,115 (9340 577 66115) | L4 | BAS521 |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| Reel 7" Q1/T1 Pitch 2mm | Active | BAS521,315 (9340 577 66315) | L4 | BAS521 | | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 | ||||
| Reel 11¼" Q1/T1 in LargePack | Active | BAS521,135 (9340 577 66135) | L4 | BAS521 | | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS521 NXP Product Quality BAS521
- BAS521 NXP® Product Reliability BAS521
- BAS521 SPICE model BAS521
- plastic surface-mounted package; 2 leads pesd5z7.0
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
- Tape reel; standard product orientation 12NC ending 315 pesd5v0u1bb
- Tape reel; standard product orientation 12NC ending 135 pesd5z5.0
- BAS521
- BB208-02
