BAS70: 通用肖特基二极管
通用肖特基二极管采用小型表面贴装器件（SMD）塑料封装。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| General-purpose Schottky diodes (REV 9.0) PDF (215.0 kB) BAS70_1PS7XSB70_SER [English] | 28 Jan 2010 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS70 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS70_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS70 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAS70_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BAS70 SPICE model (REV 1.3) prm BAS70 6/8/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | VR [max] (V) | IR [max] (µA) | IF [max] (mA) | IFSM [max] (A) | Configuration | VF [max] (mV) | Cd [max] (pF) | IR [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS70 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 70 | 0.1@VR=50V | 70 | 0.1 | single | 750@IF=10mA | 2@VR=0V | 0.01@VR=70V | ||
| BAS70/G | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 70 | 0.1@VR=50V | 70 | 0.1 | single | 750@IF=10mA | 2@VR=0V | 0.01@VR=70V |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS70 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BAS70,235 (9340 207 90235) | 73% | BAS70 |    | week 34, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BAS70,215 (9340 207 90215) | 73% | BAS70 | | week 34, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- General-purpose Schottky diodes BAS70XY
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS70 NXP Product Quality BAS70
- BAS70 NXP® Product Reliability BAS70
- BAS70 SPICE model BAS70_SERIES_1PS7XSB70_SERIES
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
