BAS70-04: 通用肖特基二极管

通用肖特基二极管采用小型表面贴装器件(SMD)塑料封装。

SOT023
数据手册 (1)
名称/描述Modified Date
General-purpose Schottky diodes (REV 9.0) PDF (215.0 kB) BAS70_1PS7XSB70_SER [English]28 Jan 2010
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BAS70-04 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS70-04_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAS70-04 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAS70-04_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
BAS70-04ActiveSOT23TO-236AB2.9 x 1.3 x 10.1@VR=50Vdual series750@IF=10mA0.12@VR=0V0.01@VR=70V7070
BAS70-04/GNo Longer ManufacturedSOT23TO-236AB2.9 x 1.3 x 10.1@VR=50Vdual series750@IF=10mA0.12@VR=0V0.01@VR=70V7070
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAS70-04SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBAS70-04,235 (9340 208 00235)74%BAS70-04Always Pb-free157.00.731.37E911
Reel 7" Q3/T4ActiveBAS70-04,215 (9340 208 00215)74%BAS70-04week 34, 2003157.00.731.37E911
General-purpose Schottky diodes BAS70XY
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAS70-04 NXP Product Quality BAS70-04
BAS70-04 NXP® Product Reliability BAS70-04
BAS70-04 SPICE model BAS70-04
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
PMBFJ309