BAT754S: 肖特基势垒二极管

平面肖特基势垒二极管,带集成应力保护环,采用小型SOT23 (TO-236AB)表面贴装器件(SMD)塑料封装。

BAT754S: 产品结构框图
BAT754S: 应用结构框图
BAT754S: 应用结构框图
BAT754S: 应用结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
Schottky barrier diodes (REV 3.0) PDF (239.0 kB) BAT754_SER [English]17 Oct 2012
应用说明 (1)
名称/描述Modified Date
Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board (REV 1.0) PDF (260.0 kB) AN10361 [English]20 Jun 2005
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BAT754S NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT754S_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAT754S NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT754S_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
BAT754SActiveSOT23TO-236AB2.9 x 1.3 x 12@VR=25Vdual series340@IF=10mA0.610@VR=1V30200
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAT754SSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBAT754S,215 (9340 557 32215)2N%BAT754Sweek 34, 2003157.00.731.37E911
Schottky barrier diodes BAT754S
Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board BAT754S
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAT754S NXP Product Quality BAT754S
BAT754S NXP® Product Reliability BAT754S
BAT754S SPICE model BAT754S
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
1PS70SB82_1PS70SB84_1PS70SB85_1PS70SB86
BAT754_SERIES
1PS70SB82_1PS70SB84_1PS70SB85_1PS70SB86
PMBFJ309