BAV756S: 高速开关二极管

高速开关二极管,采用小型表面贴装设备(SMD)塑料封装。

SOT363
数据手册 (1)
名称/描述Modified Date
High-speed switching diodes (REV 6.0) PDF (370.0 kB) BAV756S_BAW56_SER [English]18 Mar 2015
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English]15 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BAV756S NXP Product Quality (REV 1.2) PDF (74.0 kB) BAV756S_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAV756S NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAV756S_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)VR [max] (V)VR max (V)IFSM max (A)IFSM [max] (A)VF [max] (mV)VFmax (mV)IR max (nA)IR [max] (nA)IFRM (mA)IFRM (mA)Configurationtrr max (ns)trr [max] (ns)IF max (mA)IF [max] (mA)Cd [max] (pF)Cd max. (pF)
BAV756SActiveSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA2500@VR=75V2500@VR=75V450450quad c.a./c.c.4425025022
BAV756S/GNo Longer ManufacturedSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA2500@VR=75V2500@VR=75V450450quad c.a./c.c.4425025022
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAV756SSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBAV756S,115 (9340 529 10115)A7%BAV756Sweek 23, 2003347.01.616.21E811
High-speed switching diodes BAW56W
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAV756S NXP Product Quality BAV756S
BAV756S NXP® Product Reliability BAV756S
MAR_SOT363 Topmark BSS84AKS
LSYMDIO_1 BAW56W
BAV756S SPICE model BAV756S_BAW56_SERIES
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
BFU520Y