BAW56S: 高速开关二极管

高速开关二极管,采用小型表面贴装设备(SMD)塑料封装。

SOT363
数据手册 (1)
名称/描述Modified Date
High-speed switching diodes (REV 6.0) PDF (370.0 kB) BAV756S_BAW56_SER [English]18 Mar 2015
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT363_135 [English]20 Nov 2012
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English]15 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BAW56S NXP Product Quality (REV 1.3) PDF (74.0 kB) BAW56S_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAW56S NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAW56S_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)VR max (V)VR [max] (V)IFSM max (A)IFSM [max] (A)VF [max] (mV)VFmax (mV)IR [max] (nA)IR max (nA)IFRM (mA)IFRM (mA)Configurationtrr [max] (ns)trr max (ns)IF max (mA)IF [max] (mA)Cd max. (pF)Cd [max] (pF)
BAW56S/ZLActiveSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA1000@VR=75V1000@VR=75V450450quad series/c.a.4425025022
BAW56SActiveSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA1000@VR=75V1000@VR=75V450450quad series/c.a.4425025022
BAW56S/A2No Longer ManufacturedSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA1000@VR=75V1000@VR=75V450450quad series/c.a.4425025022
BAW56S/DGNo Longer ManufacturedSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA1000@VR=75V1000@VR=75V450450quad series/c.a.4425025022
BAW56S/GNo Longer ManufacturedSOT363TSSOP62 x 1.25 x 0.957575441000@IF=50mA1000@IF=50mA1000@VR=75V1000@VR=75V450450quad series/c.a.4425025022
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAW56SSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBAW56S,135 (9340 457 30135)A1%BAW56Sweek 23, 2003347.01.616.21E811
Reel 7" Q1/T1ActiveBAW56S,115 (9340 457 30115)A1%BAW56Sweek 23, 2003347.01.616.21E811
BAW56S/ZLSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBAW56S/ZLF (9340 697 63135)Standard MarkingBAW56S/ZLAlways Pb-free347.01.616.21E811
Reel 7" Q1/T1ActiveBAW56S/ZLX (9340 697 63115)Standard MarkingBAW56S/ZLAlways Pb-free347.01.616.21E811
High-speed switching diodes BAW56W
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAW56S NXP Product Quality BAW56S
BAW56S NXP® Product Reliability BAW56S
MAR_SOT363 Topmark BSS84AKS
LSYMDIO_1 BAW56W
BAW56S SPICE model BAW56S
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
BFU520Y