BC56PA: 80 V，1 A NPN中等功率晶体管
NPN中等功率晶体管，采用SOT1061无引脚超小型表面贴装器件(SMD)塑料封装。PNP补充产品：BC53PA。
Outline 3d SOT1061
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 80 V, 1 A NPN medium power transistors (REV 9.0) PDF (1.1 MB) BCP56_BCX56_BC56PA [English] | 07 Nov 2011 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC56PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC56PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC56PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC56PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BC56PA SPICE model (REV 1.4) prm BC56PA 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Complement | Ptot (mW) | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC56PA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | BC53PA | 1000 | NPN | 1650 | 80 | 180 | 250 | 40 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC56PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC56PA,115 (9340 657 45115) | AZ | BC56PA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Medium-power general-purpose transistors BSR43
- BC56PA NXP Product Quality BC56PA
- BC56PA NXP® Product Reliability BC56PA
- BC56PA SPICE model BCP56_BCX56_BC56PA
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- PTVSXU1UPA_SERIES
