BC68PA: 20 V,2 A NPN中等功率晶体管

NPN中等功率晶体管,采用SOT1061无引脚超小型表面贴装器件(SMD)塑料封装。PNP补充产品:BC69PA。

Outline 3d SOT1061
数据手册 (1)
名称/描述Modified Date
20 V, 2A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP68_BC868_BC68PA [English]02 Nov 2011
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (1)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BC68PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC68PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC68PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC68PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)ComplementPtot (mW)IC [max] (mA)IC max (mA)PolarityPtot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]hFE [min]
BC68PAActiveSOT1061DFN2020-32 x 2 x 0.65BC69PA2000NPN16502017037540
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC68PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC68PA,115 (9340 657 36115)ARBC68PAAlways Pb-free153.00.711.41E911
20 V, 2A NPN medium power transistors BCP68-25
Medium-power general-purpose transistors BSR43
BC68PA NXP Product Quality BC68PA
BC68PA NXP® Product Reliability BC68PA
BC68PA SPICE model BCP68_BC868_BC68PA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES