BC857: PNP通用晶体管

PNP晶体管,采用SOT23塑料封装。

NPN补充产品:BC846、BC847和BC848。

BC857: 产品结构框图
SOT023
数据手册 (1)
名称/描述Modified Date
PNP general purpose transistors (REV 6.0) PDF (158.0 kB) BC856_BC857_BC858 [English]16 Jan 2004
应用说明 (1)
名称/描述Modified Date
18 W CFL lamp design using UBA2024 application development tool and application examples (REV 4.0) PDF (740.0 kB) AN10713 [English]11 Feb 2011
用户指南 (4)
名称/描述Modified Date
UBA2024AP DIP8 18W demo board (REV 3.0) PDF (359.0 kB) UM10388 [English]27 Jan 2011
UBA2024AT SO14 18 W demo board (REV 3.0) PDF (180.0 kB) UM10387 [English]26 Jan 2011
UBA2024T SO14 13W demo board (REV 3.0) PDF (178.0 kB) UM10392 [English]26 Jan 2011
UBA2024P DIP8 13 W demo board (REV 3.0) PDF (355.0 kB) UM10393 [English]26 Jan 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BC857 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC857_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC857 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC857_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
软件
订购信息
型号状态Package versionPackage name大小 (mm)ComplementPtot (mW)ConfigurationIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]fr [min] (MHz)hFE [min]
BC857ActiveSOT23TO-236AB2.9 x 1.3 x 12501-100PNP-45800125
BC857/A2No Longer ManufacturedSOT23TO-236AB2.9 x 1.3 x 12501-100PNP-45800125
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC857SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBC857,215 (9335 897 40215)3H%BC857week 34, 2003153.00.711.41E911
Reel 11" Q3/T4, LargePackActiveBC857,235 (9335 897 40235)3H%BC857week 34, 2003153.00.711.41E911
PNP general purpose transistors BC858B
18 W CFL lamp design using UBA2024 application development tool and application examples BAV70W
UBA2024AP DIP8 18W demo board BC858W
UBA2024AT SO14 18 W demo board BC858W
UBA2024T SO14 13W demo board BC858W
UBA2024P DIP8 13 W demo board BC858W
Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
BC857 NXP Product Quality BC857
BC857 NXP® Product Reliability BC857
Letter Symbols - Transistors; General PEMD16
BC857 SPICE model BC857
BC857A_1_2 BC858B
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
PMMT591A
PMBFJ309