BC857BM: PNP通用晶体管

PNP通用晶体管,采用SOT883无引脚超小型塑料封装。NPN补充产品:BC847M系列。

BC857BM: 产品结构框图
SOT883
数据手册 (1)
名称/描述Modified Date
PNP general purpose transistors (REV 2.0) PDF (154.0 kB) BC857M_SERIES [English]10 Mar 2004
应用说明 (1)
名称/描述Modified Date
18 W CFL lamp design using UBA2024 application development tool and application examples (REV 4.0) PDF (740.0 kB) AN10713 [English]11 Feb 2011
用户指南 (4)
名称/描述Modified Date
UBA2024AP DIP8 18W demo board (REV 3.0) PDF (359.0 kB) UM10388 [English]27 Jan 2011
UBA2024AT SO14 18 W demo board (REV 3.0) PDF (180.0 kB) UM10387 [English]26 Jan 2011
UBA2024T SO14 13W demo board (REV 3.0) PDF (178.0 kB) UM10392 [English]26 Jan 2011
UBA2024P DIP8 13 W demo board (REV 3.0) PDF (355.0 kB) UM10393 [English]26 Jan 2011
封装信息 (1)
名称/描述Modified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
BC857BM NXP Product Quality (REV 1.2) PDF (74.0 kB) BC857BM_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC857BM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC857BM_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementConfigurationIC [max] (mA)PolarityIC max (mA)Ptot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]fr [min] (MHz)hFE [min]
BC857BMActiveSOT883DFN1006-31.0 x 0.6 x 0.54301-100PNP-45475220
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC857BMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveBC857BM,315 (9340 571 47315)D2BC857BMAlways Pb-free153.00.711.41E911
PNP general purpose transistors BC857CM
18 W CFL lamp design using UBA2024 application development tool and application examples BAV70W
UBA2024AP DIP8 18W demo board BC858W
UBA2024AT SO14 18 W demo board BC858W
UBA2024T SO14 13W demo board BC858W
UBA2024P DIP8 13 W demo board BC858W
BC857BM NXP Product Quality BC857BM
BC857BM NXP® Product Reliability BC857BM
BC857BM SPICE model BC857M_SERIES
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PBSS3515M
PMZ950UPE