BC857BM: PNP通用晶体管
PNP通用晶体管，采用SOT883无引脚超小型塑料封装。NPN补充产品：BC847M系列。
BC857BM: 产品结构框图
SOT883
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP general purpose transistors (REV 2.0) PDF (154.0 kB) BC857M_SERIES [English] | 10 Mar 2004 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| 18 W CFL lamp design using UBA2024 application development tool and application examples (REV 4.0) PDF (740.0 kB) AN10713 [English] | 11 Feb 2011 |
用户指南 (4)
| 名称/描述 | Modified Date |
|---|---|
| UBA2024AP DIP8 18W demo board (REV 3.0) PDF (359.0 kB) UM10388 [English] | 27 Jan 2011 |
| UBA2024AT SO14 18 W demo board (REV 3.0) PDF (180.0 kB) UM10387 [English] | 26 Jan 2011 |
| UBA2024T SO14 13W demo board (REV 3.0) PDF (178.0 kB) UM10392 [English] | 26 Jan 2011 |
| UBA2024P DIP8 13 W demo board (REV 3.0) PDF (355.0 kB) UM10393 [English] | 26 Jan 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC857BM NXP Product Quality (REV 1.2) PDF (74.0 kB) BC857BM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC857BM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC857BM_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BC857BM SPICE model (REV 1.4) prm BC857BM 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Ptot (mW) | Complement | Configuration | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | fr [min] (MHz) | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857BM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 430 | 1 | -100 | PNP | -45 | 475 | 220 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857BM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BC857BM,315 (9340 571 47315) | D2 | BC857BM |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PNP general purpose transistors BC857CM
- 18 W CFL lamp design using UBA2024 application development tool and application examples BAV70W
- UBA2024AP DIP8 18W demo board BC858W
- UBA2024AT SO14 18 W demo board BC858W
- UBA2024T SO14 13W demo board BC858W
- UBA2024P DIP8 13 W demo board BC858W
- BC857BM NXP Product Quality BC857BM
- BC857BM NXP® Product Reliability BC857BM
- BC857BM SPICE model BC857M_SERIES
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PBSS3515M
- PMZ950UPE
