BC857XQA series: 45 V, 100 mA PNP general-purpose transistors
PNP general-purpose transistors in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and soldarable side pads.
Type Number
Package
NPN complement
NXP
JEITA
JEDEC
BC857AQA
DFN1010D-3
(SOT1215)
-
-
BC847AQA
BC857BQA
BC847BQA
BC857CQA
BC847CQA
sot1215_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 45 V, 100 mA PNP general-purpose transistors (REV 1.0) PDF (718.0 kB) BC857XQA_SER [English] | 26 Aug 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BC857AQA SPICE model (REV 1.1) TXT BC857AQA 7/15/2015
- BC857BQA SPICE model (REV 1.1) TXT BC857BQA 7/15/2015
- BC857CQA SPICE model (REV 1.1) TXT BC857CQA 7/15/2015
订购信息
| 型号 | 状态 |
|---|---|
| BC857BQA | Active |
| BC857CQA | Active |
| BC857AQA | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857BQA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC857BQAZ (9340 690 71147) | Standard Marking | BC857BQA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC857AQA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC857AQAZ (9340 690 69147) | Standard Marking | BC857AQA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC857CQA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC857CQAZ (9340 690 72147) | Standard Marking | BC857CQA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 45 V, 100 mA PNP general-purpose transistors BC857XQA_SERIES
- BC857AQA SPICE model BC857XQA_SERIES
- BC857BQA SPICE model BC857XQA_SERIES
- BC857CQA SPICE model BC857XQA_SERIES
- DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
