BCM857DS: PNP/PNP匹配双晶体管
PNP/PNP匹配双晶体管，采用小型表面贴装器件(SMD)塑料封装。晶体管在内部完全隔离。
BCM857DS: 产品结构框图
BCM857DS: 应用结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP/PNP matched double transistors (REV 6.0) PDF (116.0 kB) BCM857BV_BS_DS [English] | 21 Sep 2009 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BCM857DS NXP Product Quality (REV 1.2) PDF (74.0 kB) BCM857DS_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCM857DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCM857DS_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- BCM857DS SPICE model (REV 1.4) prm BCM857DS 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | 说明 |
|---|---|---|---|---|---|
| BCM857DS | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCM857DS | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCM857DS,135 (9340 590 33135) | R8 | BCM857DS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCM857DS,115 (9340 590 33115) | R8 | BCM857DS | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PNP/PNP matched double transistors BCM857DS
- BCM857DS NXP Product Quality BCM857DS
- BCM857DS NXP® Product Reliability BCM857DS
- MAR_SOT457 Topmark 74LVC2G17_Q100
- BCM857DS SPICE model BCM857DS
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 bza456a
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- 1PS66SB82_1PS88SB82
- PBSS5160DS
- SSL5021_SSL5031
