BCP55-10: 60 V,1 A NPN中等功率晶体管

NPN中等功率晶体管,采用SOT223表面贴装器件(SMD)塑料封装。PNP补充产品:BCP52。

SOT223
数据手册 (1)
名称/描述Modified Date
60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA [English]10 Nov 2011
应用说明 (1)
名称/描述Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BCP55-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP55-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]hFE [min]
BCP55-10ActiveSOT223SC-736.5 x 3.5 x 1.65BCP52-101000NPN13506018016063
BCP55-10/ANo Longer ManufacturedSOT223SC-736.5 x 3.5 x 1.65
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCP55-10SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP55-10,115 (9339 172 20115)BCP55/10BCP55-10week 34, 2003153.00.711.41E911
60 V, 1 A NPN medium power transistors BCX55-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BCP55-10 NXP Product Quality BCP55-10
BCP55-10 NXP® Product Reliability BCP55-10
Letter Symbols - Transistors; General PEMD16
BCP55-10 SPICE model BCP55-10
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81