BCP56; BCX56; BC56PA: 80 V，1 A NPN中等功率晶体管
NPN中等功率晶体管系列，采用表面贴装器件(SMD)塑料封装。
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 80 V, 1 A NPN medium power transistors (REV 9.0) PDF (1.1 MB) BCP56_BCX56_BC56PA [English] | 07 Nov 2011 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (6)
| 名称/描述 | Modified Date |
|---|---|
| SOT89 Reel pack, SMD, 7" T4 Turned 90 degree product orientation Ordering code (12NC) ending 147 (REV 1.0) PDF (134.0 kB) SOT89_147 [English] | 04 Mar 2014 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (18)
| 名称/描述 | Modified Date |
|---|---|
| BC56-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC56-10PA [English] | 31 Jan 2015 |
| BC56-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC56-10PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC56-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC56-16PA [English] | 31 Jan 2015 |
| BC56-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC56-16PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC56PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC56PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC56PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC56PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP56-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP56-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP56-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP56-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP56 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP56 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX56-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX56-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX56-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX56-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX56-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX56-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX56-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX56-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX56 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX56_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX56 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX56_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BCP56-16 SPICE model (REV 1.0) TXT BCP56-16_1 5/11/2016
- BC56-10PA SPICE model (REV 1.4) prm BC56-10PA_1 7/22/2012
- BC56-16PA SPICE model (REV 1.4) prm BC56-16PA_1 7/22/2012
- BC56PA SPICE model (REV 1.4) prm BC56PA 7/22/2012
- BCP56 SPICE model (REV 1.4) prm BCP56 7/22/2012
- BCP56-10 SPICE model (REV 1.4) prm BCP56-10 7/22/2012
- BCX56 SPICE model (REV 1.4) prm BCX56 7/22/2012
- BCX56-10 SPICE model (REV 1.4) prm BCX56-10 7/22/2012
- BCX56-16 SPICE model (REV 1.4) prm BCX56-16 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BCP56 | Active |
| BCX56-10 | Active |
| BC56-10PA | Active |
| BC56PA | Active |
| BC56-16PA | Active |
| BCX56-16 | Active |
| BCX56 | Active |
| BCP56-16 | Active |
| BCP56-10 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56-10 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP56-10,135 (9339 172 50135) | BCP56/10 | BCP56-10 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP56-10,115 (9339 172 50115) | BCP56/10 | BCP56-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCX56-10 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX56-10,135 (9336 630 90135) | BK | BCX56-10 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX56-10,115 (9336 630 90115) | BK | BCX56-10 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC56-16PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC56-16PA,115 (9340 658 11115) | BL | BC56-16PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC56PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC56PA,115 (9340 657 45115) | AZ | BC56PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCX56-16 | | SOT89 | Reel 7" Q1/T1 | Active | BCX56-16,115 (9336 747 60115) | BL | BCX56-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q2/T3 | Active | BCX56-16,147 (9336 747 60147) | BL | BCX56-16 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| Reel 11¼" Q1/T1 in LargePack | Active | BCX56-16,135 (9336 747 60135) | BL | BCX56-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC56-10PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC56-10PA,115 (9340 658 09115) | BK | BC56-10PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP56 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP56,115 (9339 172 40115) | BCP56 | BCP56 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BCP56F (9339 172 40135) | BCP56 | BCP56 | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCP56/ZL | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP56/ZLF (9340 707 66135) | Standard Marking | BCP56/ZL | 153.0 | 0.71 | 1.41E9 | ||||
| Reel 7" Q1/T1 | Active | BCP56/ZLX (9340 707 66115) | Standard Marking | BCP56/ZL | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCX56 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX56,135 (9332 723 30135) | BH | BCX56 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX56,115 (9332 723 30115) | BH | BCX56 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCX56/FD | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Withdrawn | BCX56/FD,135 (9340 170 10135) | BH | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | NA | ||
| BCP56-16 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP56-16,135 (9339 172 60135) | BCP56/16 | BCP56-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP56-16,115 (9339 172 60115) | BCP56/16 | BCP56-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BC56-10PA NXP® Product Reliability BC56-10PA
- BC56-10PA NXP Product Quality BC56-10PA
- BC56-16PA NXP® Product Reliability BC56-16PA
- BC56-16PA NXP Product Quality BC56-16PA
- BC56PA NXP Product Quality BC56PA
- BC56PA NXP® Product Reliability BC56PA
- BCP56-10 NXP Product Quality BCP56-10
- BCP56-10 NXP® Product Reliability BCP56-10
- BCP56-16 NXP Product Quality BCP56-16
- BCP56-16 NXP® Product Reliability BCP56-16
- BCP56 NXP Product Quality BCP56
- BCP56 NXP® Product Reliability BCP56
- BCX56-10 NXP Product Quality BCX56-10
- BCX56-10 NXP® Product Reliability BCX56-10
- BCX56-16 NXP Product Quality BCX56-16
- BCX56-16 NXP® Product Reliability BCX56-16
- BCX56 NXP Product Quality BCX56
- BCX56 NXP® Product Reliability BCX56
- Letter Symbols - Transistors; General PEMD16
- BCP56-16 SPICE model BCP56_BCX56_BC56PA
- BC56-10PA SPICE model BCP56_BCX56_BC56PA
- BC56-16PA SPICE model BCP56_BCX56_BC56PA
- BC56PA SPICE model BCP56_BCX56_BC56PA
- BCP56 SPICE model BCP56_BCX56_BC56PA
- BCP56-10 SPICE model BCP56-10
- BCX56 SPICE model BCX56
- BCX56-10 SPICE model BCX56-10
- BCX56-16 SPICE model BCX56-16
- SOT89 Reel pack, SMD, 7" T4 Turned 90 degree product orientation Ordering code (12NC) ending 147 BCX56-16
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- PTVSXU1UPA_SERIES
- BFU590Q
- BLT81
