BCV28: PNP达林顿晶体管

PNP达林顿晶体管,采用SOT89塑料封装。

NPN补充产品:BCV29和BCV49。

BCV28: 产品结构框图
BCV28: 应用结构框图
SOT089
数据手册 (1)
名称/描述Modified Date
PNP Darlington transistors (REV 5.0) PDF (120.0 kB) BCV28_48 [English]06 Dec 2004
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BCV28 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCV28_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCV28 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCV28_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementVCEO [max] (V)ConfigurationIC [max] (mA)PolarityIC max (mA)Ptot [max] (mW)fT [min] (MHz)hFE maxhFE [max]hFE [min]fr [min] (MHz)VCES [max] (V)
BCV28ActiveSOT89SOT894.5 x 2.5 x 1.51300BCV29-301-500PNP1300220>200002000030
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCV28SOT89Reel 7" Q1/T1ActiveBCV28,115 (9338 715 80115)EDBCV28week 28, 2003153.00.711.41E911
PNP Darlington transistors BCV48
BCV28 NXP Product Quality BCV28
BCV28 NXP® Product Reliability BCV28
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BCV28 SPICE model BCV28_BCV48
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
BZV49_SERIES
BFU590Q