BCW33: NPN通用晶体管

NPN晶体管,采用SOT23塑料封装。

PNP补充产品:BCW29和BCW30。

SOT023
数据手册 (1)
名称/描述Modified Date
NPN general purpose transistors (REV 5.0) PDF (113.0 kB) BCW31_BCW32_BCW33 [English]06 Feb 2004
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BCW33 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCW33_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCW33 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCW33_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementConfigurationIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]hFE [min]fr [min] (MHz)
BCW33ActiveSOT23TO-236AB2.9 x 1.3 x 12501100NPN32800420
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCW33SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBCW33,215 (9330 996 50215)D3%BCW33week 34, 2003153.00.711.41E911
NPN general purpose transistors BCW33
BCW33 NXP Product Quality BCW33
BCW33 NXP® Product Reliability BCW33
Letter Symbols - Transistors; General PEMD16
BCW33 SPICE model BCW33
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
PMBFJ309