BCW60 series: NPN通用晶体管
NPN晶体管，采用SOT23塑料封装。
PNP补充产品：BCW61系列。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN general purpose transistors (REV 3.0) PDF (120.0 kB) BCW60 [English] | 22 Apr 1999 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BCW60B NXP Product Quality (REV 1.2) PDF (74.0 kB) BCW60B_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCW60B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCW60B_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCW60C NXP Product Quality (REV 1.2) PDF (74.0 kB) BCW60C_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCW60C NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCW60C_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCW60D NXP Product Quality (REV 1.2) PDF (74.0 kB) BCW60D_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCW60D NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCW60D_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BCW60B SPICE model (REV 1.4) prm BCW60B 7/22/2012
- BCW60C SPICE model (REV 1.4) prm BCW60C 7/22/2012
- BCW60D SPICE model (REV 1.4) prm BCW60D 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BCW60D | Active |
| BCW60C | Active |
| BCW60B | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCW60B | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BCW60B,235 (9333 240 90235) | AB% | BCW60B |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BCW60B,215 (9333 240 90215) | AB% | BCW60B | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCW60D | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BCW60D,235 (9333 241 10235) | AD% | BCW60D | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BCW60D,215 (9333 241 10215) | AD% | BCW60D | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCW60C | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BCW60C,235 (9333 241 00235) | AC% | BCW60C | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BCW60C,215 (9333 241 00215) | AC% | BCW60C | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BCW60B NXP Product Quality BCW60B
- BCW60B NXP® Product Reliability BCW60B
- BCW60C NXP Product Quality BCW60C
- BCW60C NXP® Product Reliability BCW60C
- BCW60D NXP Product Quality BCW60D
- BCW60D NXP® Product Reliability BCW60D
- Letter Symbols - Transistors; General PEMD16
- BCW60B SPICE model BCW60B
- BCW60C SPICE model BCW60C
- BCW60D SPICE model BCW60D
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
