BF822: NPN高压晶体管

NPN高压晶体管,采用SOT23塑料封装。

PNP补充产品:BF821、BF823。

SOT023
数据手册 (1)
名称/描述Modified Date
NPN high voltage transistors (REV 4.0) PDF (99.0 kB) BF820_BF822 [English]16 Jan 2004
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BF822 NXP Product Quality (REV 1.2) PDF (74.0 kB) BF822_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BF822 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BF822_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)hFE minPtot (mW)VCEO [max] (V)hFE maxConfigurationfT min (MHz)hFE [min]ComplementIC max (mA)IC [max] (mA)hFE [max]VCEO max (V)Ptot max (mW)fT [min] (MHz)fr [min] (MHz)Polarity
BF822ActiveSOT23TO-236AB2.9 x 1.3 x 150250250>5016050BF8235050250250NPN
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BF822SOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBF822,215 (9336 408 90215)1X%BF822week 34, 2003153.00.711.41E911
NPN high voltage transistors BF822
BF822 NXP Product Quality BF822
BF822 NXP® Product Reliability BF822
Letter Symbols - Transistors; General PEMD16
BF822 SPICE model BF822
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
PMBFJ309