BF824W: PNP中频晶体管

PNP中频晶体管,采用SOT323塑料封装。

SOT323
数据手册 (1)
名称/描述Modified Date
PNP medium frequency transistor (REV 3.0) PDF (99.0 kB) BF824W [English]15 Apr 1999
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BF824W NXP Product Quality (REV 1.2) PDF (74.0 kB) BF824W_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BF824W NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BF824W_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)hFE minConfigurationhFE maxVCEO [max] (V)fT min (MHz)Ptot max (mW)hFE [min]IC [max] (mA)IC max (mA)hFE [max]VCEO max (V)fT [min] (MHz)Polarityfr [min] (MHz)Complement
BF824WActiveSOT323SC-702 x 1.25 x 0.9525>254002002530PNP
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BF824WSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBF824W,135 (9340 286 30135)F8%BF824Wweek 30, 2003153.00.711.41E911
PNP medium frequency transistor BF824W
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
BF824W NXP Product Quality BF824W
BF824W NXP® Product Reliability BF824W
Letter Symbols - Transistors; General PEMD16
BF824W SPICE model BF824W
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BAT854CW
PRF947