BSP19: NPN高压晶体管
NPN晶体管，采用SOT223塑料封装。
PNP补充产品：BSP16。
SOT223
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN high-voltage transistors (REV 3.0) PDF (95.0 kB) BSP19_20 [English] | 01 Jun 1999 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BSP19 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP19_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP19 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP19_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BSP19 SPICE model (REV 1.4) prm BSP19 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | hFE min | Ptot (mW) | VCEO [max] (V) | Configuration | IC max (mA) | fT min (MHz) | hFE [min] | IC [max] (mA) | hFE max | VCEO max (V) | hFE [max] | Ptot max (mW) | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP19 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 40 | 1200 | 350 | 1 | 50 | 70 | 40 | 100 | >40 | 350 | 1200 | NPN |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP19 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP19,115 (9339 834 00115) | BSP19 | BSP19 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BSP19 NXP Product Quality BSP19
- BSP19 NXP® Product Reliability BSP19
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BSP19 SPICE model BSP19
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
