BZA856AVL: 四倍低电容ESD抑制器

单芯片瞬态电压抑制器二极管采用5引脚SOT353 (SC-88A)封装,可提供4位宽度的ESD瞬态抑制。

BZA856AVL: 产品结构框图
Outline 3d SOT353
数据手册 (1)
名称/描述Modified Date
Quadruple low capacitance ESD suppressor (REV 2.0) PDF (182.0 kB) BZA800AVL_SERIES [English]20 Oct 2003
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BZA856AVL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA856AVL [English]31 Jan 2015
BZA856AVL NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA856AVL_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English]03 Jun 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
BZA856AVLActiveSOT353TSSOP52 x 1.25 x 0.954Unidirectional22283.3150.2
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BZA856AVLSOT353Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBZA856AVL,115 (9340 574 88115)R3%BZA856AVLweek 31, 2003117.00.541.85E911
Quadruple low capacitance ESD suppressor bza868avl
BZA856AVL NXP® Product Reliability bza856avl
BZA856AVL NXP Product Quality bza856avl
MAR_SOT353 Topmark 74LVC1G17_Q100
BZA856AVL SPICE model BZA856AVL
plastic surface-mounted package; 5 leads NX3L1G66GW-Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4ug
BZA800AVL_SERIES
NCX2202