BZA900AVL series: 四倍低电容ESD抑制器

单芯片瞬态电压抑制器二极管采用5引脚SOT665封装,可提供4位宽度的ESD瞬态抑制。

BZA900AVL_SERIES: 产品结构框图
sot665_3d
数据手册 (1)
名称/描述Modified Date
Quadruple low capacitance ESD suppressor (REV 3.0) PDF (170.0 kB) BZA900AVL_SERIES [English]20 Oct 2003
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English]03 Dec 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BZA962AVL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA962AVL [English]31 Jan 2015
BZA962AVL NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA962AVL_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态
BZA962AVLActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BZA962AVLSOT665Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBZA962AVL,115 (9340 572 98115)V2BZA962AVLAlways Pb-free117.00.541.85E911
Quadruple low capacitance ESD suppressor bza968avl
BZA962AVL NXP® Product Reliability bza962avl
BZA962AVL NXP Product Quality bza962avl
BZA962AVL SPICE model BZA962AVL
plastic surface-mounted package; 5 leads pesd5v0v4uw
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
BZA900AVL_SERIES
IP4256CZ3_M_CZ5_W_CZ6_F