BZB784-C9V1: 双倍稳压器二极管

低功率稳压器二极管,采用小型SOT323 (SC-70)封装。

BZB784-C9V1: 产品结构框图
SOT323
数据手册 (1)
名称/描述Modified Date
Voltage regulator double diodes (REV 2.1) PDF (370.0 kB) BZB784_SERIES [English]18 Nov 2009
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BZB784-C9V1 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZB784-C9V1 [English]31 Jan 2015
BZB784-C9V1 NXP Product Quality (REV 1.2) PDF (74.0 kB) BZB784-C9V1_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)PZSM (W)VZ nom (V)ConfigurationVZ max. (V)IF max (mA)VZ min. (V)Tolerance +/-Ptot (mW)
BZB784-C9V1ActiveSOT323SC-702 x 1.25 x 0.95409.1dual c.a.9.62008.55%350
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BZB784-C9V1SOT323Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBZB784-C9V1,115 (9340 563 10115)9F%BZB784-C9V1week 30, 2003117.00.541.85E911
Voltage regulator double diodes BZB784-C9V1
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BZB784-C9V1 NXP® Product Reliability BZB784-C9V1
BZB784-C9V1 NXP Product Quality BZB784-C9V1
BZB784-C9V1 SPICE model BZB784-C9V1
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
BZB784_SERIES
PRF947