LM75A: 数字温度传感器与温度监控器

LM75A是一款温度-数字转换器,采用片内带隙温度传感器和Σ-Δ型A-D转换技术制造。该器件还是一个热检测器,具有过温检测输出。LM75A集成一系列数据寄存器:配置寄存器(Conf),用于存储器件设置,如器件工作模式、OS工作模式、OS极性和OS故障队列,相关说明可参见第7节:“功能说明”;温度寄存器(Temp),用于存储数字温度读数;以及设定点寄存器(Tos和Thyst),用于存储可编程过温关断和迟滞限值,可通过双线式串行I²C总线接口与控制器通信。该器件还提供开漏输出(OS),可在温度超过编程限值时激活。具有三个可选逻辑地址针脚,因此一条总线上可以连接8个器件,不会产生地址冲突。

LM75A可针对不同工作条件进行配置。可将其设为正常工作模式以便周期性监控环境温度,或者设为关断模式以便最大程度降低功耗。OS输出可在两种可选模式中的任意一种下工作:OS比较器模式或OS中断模式。它的激活状态可选为高电平或低电平。可对定义连续故障数量以激活OS输出的故障队列进行编程,也可对设定点限值进行编程。

温度寄存器始终存储11位二进制补码数据,温度分辨率为0.125 ℃。对于精确测量热漂移或热逃逸的应用,这一较高的温度分辨率尤其有用。

上电后,该器件进入正常工作模式,OS进入比较器模式,温度阈值为80 ℃,迟滞为75 ℃,因此可用作带有预定义温度设定点的独立恒温器。

LM75A: 产品结构框图
LM75A: 应用结构框图
Outline 3d SOT505-1
数据手册 (1)
名称/描述Modified Date
Digital temperature sensor and thermal watchdog (REV 4.0) PDF (137.0 kB) LM75A [English]10 Jul 2007
应用说明 (3)
名称/描述Modified Date
Level shifting techniques in I2C-bus design (REV 1.0) PDF (52.0 kB) AN10441 [English]20 Jun 2007
I2C manual (REV 1.0) PDF (4.2 MB) AN10216 [English]27 Mar 2003
I2C 2002-1A Evaluation Board (REV 2.0) PDF (2.2 MB) AN10146 [English]26 Feb 2003
用户指南 (3)
名称/描述Modified Date
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 [English]28 Apr 2014
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA [English]03 Apr 2013
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 [English]13 Jun 2006
手册 (3)
名称/描述Modified Date
NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 [English]01 Aug 2014
Evaluate the I2C-bus with a comprehensive kit; NXP® I2C 2002-1A evaluation board kits OM6285 and OM6278 (REV 1.0) PDF (1.8 MB) 75016531 [English]01 Jul 2008
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English]01 Jun 2008
选型工具指南 (1)
名称/描述Modified Date
I2C-bus temperature sensors; Small, accurate, low-cost sensors for advanced temperature regulation (REV 1.0) PDF (675.0 kB) 75015693 [English]01 Nov 2006
封装信息 (2)
名称/描述Modified Date
plastic thin shrink small outline package; 8 leads; body width 3 mm (REV 1.0) PDF (240.0 kB) SOT505-1 [English]08 Feb 2016
plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-1 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (232.0 kB) SOT96-1_118 [English]19 Apr 2013
TSSOP8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (214.0 kB) SOT505-1_118 [English]15 Apr 2013
报告或演示文稿 (1)
名称/描述Modified Date
design_con_2003_tecforum_i2c_b_1 (REV 0.1) PDF (4.2 MB) DESIGN_CON_2003_TECFORUM_I2C_B_1 [English]27 Jan 2003
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
IBIS
订购信息
型号状态Package versionRemarksStandby current (uA)Operating Temperature (Cel)I2C-bus controlledPart typeAccuracy on-chip (±°C)Operating voltage (VDC)Assignable addressesSMBus clock (kHz)
LM75ADActiveSOT96-1Extended temperature range, temperature to digital converter, programmable threshold3-55~1252.8~5.5Supervisor, Temperature2@-25~100?3@-55~1252.8~5.58400
LM75ADPActiveSOT505-1Extended temperature range, temperature to digital converter, programmable threshold3-55~1252.8~5.5Supervisor, Temperature2@-25~100?3@-55~1252.8~5.58400
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
LM75ADSOT96-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1ActiveLM75AD,118 (9352 697 75118)LM75ALM75ADweek 17, 20050.02.05E811
Bulk PackActiveLM75AD,112 (9352 697 75112)LM75ALM75ADweek 17, 20050.02.05E811
LM75ADPSOT505-1Reflow_Soldering_ProfileReel 13" Q1/T1ActiveLM75ADP,118 (9352 697 76118)L75ALM75ADPweek 13, 20050.02.05E811
LM75ADP/DGSOT505-1Reflow_Soldering_ProfileReel 13" Q1/T1DiscontinuedLM75ADP/DG,118 (9352 886 14118)L75ALM75ADP/DGAlways Pb-free0.02.05E811
Digital temperature sensor and thermal watchdog lm75a
Level shifting techniques in I2C-bus design pca9685pw
I2C manual se98apw
I2C 2002-1A Evaluation Board lm75a
I2C-bus specification and user manual pca9685pw
I2C-bus specification and user manual pca9685pw
I2C Demonstration Board 2005-1 Quick Start Guide pca9685pw
NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns pca9685pw
Evaluate the I2C-bus with a comprehensive kit; NXP® I2C 2002-1A evaluation board kits OM6285 and OM6278 lm75a
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE
I2C-bus temperature sensors; Small, accurate, low-cost sensors for advanced temperature regulation se95u
design_con_2003_tecforum_i2c_b_1 lm75a
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LM75A IBIS model LM75ADP
LM75ADP IBIS model LM75ADP
plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... CBT3306_Q100
plastic thin shrink small outline package; 8 leads; body width 3 mm pesd5v0l7bas
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... pesd5v0l7bas
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