LPC1100XL：50 MHz Cortex-M0 MCU，单电源（1.8 V至3.6 V），ADC，I2C，SPI，电源配置，256字节闪存页面

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LPC1100XL：50 MHz Cortex-M0 MCU，单电源（1.8 V至3.6 V），ADC，I2C，SPI，电源配置，256字节闪存页面

LPC1100XL微控制器的性能高达50 MHz，为Cortex-M0微控制器提供业界32位微控制器最低动态功耗(110 μA/MHz)并减少深度睡眠电流（小于2 µA）。片内功率配置可以针对任何低功率应用进行优化，帮助设计师通过最少的设计干预实现最佳功耗。功率配置是非配置低功率运行模式的最佳备选方案，可以实现动态电源管理，针对多种应用状态实现优化CPU运行。

LPC1100XL采用恩智浦独有的嵌入式闪存，将解决方案延伸至64 kB并采用256字节页擦除。256字节也擦除大大提升了片内山村的使用效率和擦除效果，实现无缝字段更新，无需擦除较大区域就可写入下一页。

特性和优势

ARM Cortex-M0处理器，工作频率为50 MHz
出色的代码密度，性能超过8位/16位单片机
实现业内最低动态功耗和便于使用的功率管理程序
可轻松移植到Cortex-M3

应用

人工输入器件（例如：鼠标）
简易电机控制（例如：风扇控制）
玩具
小家电

产品图片

演示板

OM13035
OM13016
OM13080
OM11085
OM11083
OM13047
OM11086

关键参数

型号	Core	Clock speed [max] (MHz)	DMIPS	Flash (kB)	RAM (kB)	GPIO	UART	I²C	SPI	ADC channels	ADC (bits)	Timers	Timer (bits)	SCTimer / PWM	PWM	Package name	Temperature range	IOH	Supply voltage [min] (V)	Supply voltage [max] (V)	Product status	Demoboard
LPC1102UK	Cortex-M0	50		32	8	11	1		1	5	10	22	16; 32	1	11	WLCSP	-40 °C to +85 °C	N	1.8	3.6	Production
LPC1104UK	Cortex-M0	50		32	8	11	1		1	5	10	22	16; 32	1	11	WLCSP	-40 °C to +85 °C	N	1.8	3.6	Production	OM13047
LPC1110FD20	Cortex-M0	50	42	4	1	16	1	1	1	5	10	22	16; 32	1	13	SO20	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM13016; OM11086; OM11083
LPC1111FDH20	Cortex-M0	50		8	2	16	1	1	1	5	10	22	16; 32	1	13	TSSOP20	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1111FHN33	Cortex-M0	50		8	2	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1111JHN33	Cortex-M0	50	42	8	2	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1112FD20	Cortex-M0	50	42	16	4	16	1	1	1	5	10	22	16; 32	1	13	SO20	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1112FDH20	Cortex-M0	50	42	16	4	14	1		1	5	10	22	16; 32	1	13	TSSOP20	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1112FDH28	Cortex-M0	50	42	16	4	22	1	1	1	6	10	22	16; 32	1	13	TSSOP28	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085
LPC1112FHI33	Cortex-M0	50	42	16	2	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1112FHN24	Cortex-M0	50	42	16	4	19	1	1	1	6	10	22	16; 32	1	13	HVQFN24	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1112FHN33	Cortex-M0	50		16	2	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1112JHI33	Cortex-M0	50	42	16	2	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1112JHN33	Cortex-M0	50	42	16	2	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1113FBD48	Cortex-M0	50	42	24	8	42	1	1	2	8	10	22	16; 32	1	13	LQFP48	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1113FHN33	Cortex-M0	50	42	24	4	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1113JBD48	Cortex-M0	50	42	24	8	42	1	1	2	8	10	22	16; 32	1	13	LQFP48	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1113JHN33	Cortex-M0	50	42	24	4	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1114FBD48	Cortex-M0	50	42	32	8	42	1	1	2	8	10	22	16; 32	1	13	LQFP48	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1114FDH28	Cortex-M0	50	42	32	4	22	1	1	1	6	10	22	16; 32	1	13	TSSOP28	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1114FHI33	Cortex-M0	50	42	32	4	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1114FHN33	Cortex-M0	50	42	32	4	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1114FN28	Cortex-M0	50	42	32	4	22	1	1	1	6	10	22	16; 32	1	13	DIP28	-40 °C to +85 °C	N	1.8	3.6	Production	OM13035; OM11049; OM11085; OM11086
LPC1114JBD48	Cortex-M0	50	42	32	8	42	1	1	2	8	10	22	16; 32	1	13	LQFP48	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1114JHI33	Cortex-M0	50	42	32	4	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1114JHN33	Cortex-M0	50	42	32	4	28	1	1	1	8	10	22	16; 32	1	13	HVQFN32	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1115FBD48	Cortex-M0	50	42	64	8	42	1	1	2	8	10	22	16; 32	1	13	LQFP48	-40 °C to +85 °C	N	1.8	3.6	Production
LPC1115FET48	Cortex-M0	50	42	64	8	42	1	1	2	8	10	22	16; 32	1	13	TFBGA48	-40 °C to +85 °C	N	1.8	3.6	Production
LPC1115JBD48	Cortex-M0	50	42	64	8	42	1	1	2	8	10	22	16; 32	1	13	LQFP48	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1115JET48	Cortex-M0	50	42	64	8	42	1	1	2	8	10	22	16; 32	1	13	TFBGA48	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1124JBD48	Cortex-M0	50	42		8	38	3	1		8	12			1		LQFP48	-40 °C to +105 °C	N	1.8	3.6	Production
LPC1125JBD48	Cortex-M0	50	42		8	38	3	1		8				1		LQFP48	-40 °C to +105 °C	N	1.8	3.6	Production	OM13080

封装与包装

型号	封装	Outline version	Reflow-/Wave soldering	包装	产品状态	标示	可订购的器件编号, (订购码 (12NC))
LPC1102UK	WLCSP (OL-LPC1102UK)	lpc1102uk_po		Reel 13" Q1/T1	量产	Standard Marking	LPC1102UK,118( 9352 926 25118 )
LPC1104UK	WLCSP (OL-LPC1102UK)	lpc1102uk_po		Reel 13" Q1/T1	量产	Standard Marking	LPC1104UK,118( 9352 978 32118 )
LPC1110FD20	SO20 (SOT163-1)	sot163-1_po	Reflow_Soldering_Profile Wave_Soldering_Profile	Tube in Drypack	量产	Standard Marking	LPC1110FD20,529( 9352 970 15529 )
LPC1111FDH20/002	TSSOP20 (SOT360-1)	sot360-1_po	SSOP-TSSOP-VSO-WAVE	Tube in Drypack	开发中	Standard Marking	LPC1111FDH20/002VP( 9352 970 31529 )
LPC1111FDH20/002	TSSOP20 (SOT360-1)	sot360-1_po	SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1 in Drypack	量产	Standard Marking	LPC1111FDH20/002,5( 9352 970 31518 )
LPC1111FHN33/101	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111FHN33/101,5( 9352 907 71551 )
LPC1111FHN33/102	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111FHN33/102,5( 9352 938 74551 )
LPC1111FHN33/102	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Reel 13" Q1/T1 in Drypack	量产	Standard Marking	LPC1111FHN33/1025( 9352 938 74518 )
LPC1111FHN33/103	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111FHN33/103,5( 9352 972 53551 )
LPC1111FHN33/201	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111FHN33/201,5( 9352 907 72551 )
LPC1111FHN33/202	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111FHN33/202,5( 9352 938 75551 )
LPC1111FHN33/203	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111FHN33/203,5( 9352 956 27551 )
LPC1111FHN33/303	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	开发中	Standard Marking	LPC1111FHN33/303,5( 9352 956 26551 )
LPC1111JHN33/103	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111JHN33/103E( 9353 038 18551 )
LPC1111JHN33/203	HVQFN32 (SOT865-3)	sot865-3_po	sot865-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1111JHN33/203E( 9353 038 19551 )
LPC1112FD20/102	SO20 (SOT163-1)	sot163-1_po	Reflow_Soldering_Profile Wave_Soldering_Profile	Tube in Drypack	量产	Standard Marking	LPC1112FD20/102,52( 9352 970 32529 )
LPC1112FDH20/102	TSSOP20 (SOT360-1)	sot360-1_po	SSOP-TSSOP-VSO-WAVE	Tube in Drypack	开发中	Standard Marking	LPC1112FDH20/102,5( 9352 970 33529 )
LPC1112FDH20/102	TSSOP20 (SOT360-1)	sot360-1_po	SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1 in Drypack	量产	Standard Marking	LPC1112FDH20/102:5( 9352 970 33518 )
LPC1112FDH28/102	TSSOP28 (SOT361-1)	sot361-1_po	SSOP-TSSOP-VSO-WAVE	Tube in Drypack	开发中	Standard Marking	LPC1112FDH28/102,5( 9352 970 34529 )
LPC1112FDH28/102	TSSOP28 (SOT361-1)	sot361-1_po	SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1 in Drypack	量产	Standard Marking	LPC1112FDH28/102:5( 9352 970 34518 )
LPC1112FHI33/102	HVQFN32 (SOT617-3)	sot617-3_po	sot617-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1112FHI33/102,5( 9352 974 04551 )
LPC1112FHI33/202	HVQFN32 (SOT617-3)	sot617-3_po	sot617-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1112FHI33/202,5( 9352 971 81551 )
LPC1112FHI33/203	HVQFN32 (SOT617-3)	sot617-3_po	sot617-3_fr	Tray, Bakeable, Single in Drypack	量产	Standard Marking	LPC1112FHI33/203,5( 9352 972 64551 )
LPC1112FHN24/202	HVQFN24 (SOT616-3)	sot616-3_po	sot616-3_fr	Tray, Bakeable, Multiple	量产	Standard Marking	LPC1112FHN24/202,1( 9352 983 99157 )
LPC1112FHN24/202	HVQFN24 (SOT616-3)	sot616-3_po	sot616-3_fr	Reel 13" Q1/T1 32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM LPC1104UK 32-bit ARM Cortex-M0 microcontroller; 64 kB flash and 8 kB SRAM; 12-bit ADC LPC1125JBD48 Errata sheet LPC1112 LPC1100XL Errata sheet LPC1114 LPC1100XL Errata sheet LPC1113 LPC1100XL Errata sheet LPC1111/12/13/14/15 LPC1115FET48 Errata sheet LPC1102 LPC1102UK Errata sheet LPC1110/11/12/14 LPC1114FN28 Low-cost development platform for 32-bit LPC microcontroller family; NXP® LPCXpresso LPC1769FBD100 NXP 50-MHz, 32-bit Cortex-M0™ MCU LPC112x LPC1100XL LPC111x/LPC11Cxx User manual LPC11D14FBD100 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm NXQ1TXA1 Footprint for reflow soldering SOT865-3 NXQ1TXA1 Footprint for reflow soldering SOT313-2 PCU9656B plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm PCU9656B HTQFP-HLQFP-LQFP-MSQFP-WAVE LPC54114J256BD64 Reel 13" Q1/T1 LPC1342FBD48 LQFP48; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or... SC16C752B wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm LPC1100XL plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm BGX7101HN sot616-3_fr BGX7101HN Reel 13" Q1/T1 LPC1112FHN24 HVQFN24; Reel pack; SMD, 13" Q2/T3 Turned product orientation Orderable part number ending ,128 or HP... PTN36241BBS Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20 SO20; Reel dry pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,518 or... NPIC6C4894_Q100 plastic small outline package; 20 leads; body width 7.5 mm SA615 Reel 13" Q1/T1 LPC812M101JD20 Tape reel SMD; standard product orientation 12NC ending 115 buk1m200-50sgtd Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20 plastic thin fine-pitch ball grid array package; 48 balls LPC11U00 plastic thin shrink small outline package; 20 leads; body width 4.4 mm PCA9634 Reel 13" Q1/T1 LPC824M201JDH20 plastic thin shrink small outline package; 28 leads; body width 4.4 mm PCA9685 TSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... pca9685pw TSSOP28; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or... sc16is762ipw SSOP-TSSOP-VSO-WAVE LPC1114FDH28 HVQFN32; Reel dry pack, SMD, 13" Q2/T3 turn product orientation Orderable part number ending, 528 or MP Ordering code... PTN3366BS Reel 13" Q1/T1 in Drypack LPC11U35FHI33 Footprint for reflow soldering SOT617-3 OL2381AHN plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm OL2381AHN HVQFN32; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code... pca8561_automotive plastic dual in-line package; 28 leads (600 mil) LPC1100XL Products 产品服务微处理器电源管理芯片存储器放大器和线性器件接口开关与多路复用器时钟数据转换器 Manufacturers 生产厂家 ADI Avago Cypress infineon Linear maxim Microchip NXP ON Panasonic renesas ROHM ST TI TOSHIBA Vishay 联系购买Sales +微信：@BDTIC (二维码) 手机号码：136 6222 1839 Email：bdtic@qq.com About 关于我们 Business 商务合作 Careers 人才招聘 Sitemap 网站导航 Privacy 隐私条款 ©1993 - 2024 BDTIC

LPC1100XL：50 MHz Cortex-M0 MCU，单电源（1.8 V至3.6 V），ADC，I2C，SPI，电源配置，256字节闪存页面

特性和优势

应用

产品图片

演示板

关键参数

封装与包装

Products 产品服务

Manufacturers 生产厂家

联系购买Sales