LPC11A13JHI33: 24kB闪存、6kB SRAM、HVQFN32封装

LPC11A13JHI33是一款基于ARM Cortex-M0的低成本32位微控制器，设计用于8位/16位微控制器应用，提供性能、低功率、简单指令集和内存寻址，与现有8位/16位架构相比，代码尺寸更小。LPC11A13JHI33的CPU工作频率最高可达50 MHz。模拟/混合信号子系统可通过软件从互连的数字和模拟外设进行配置。

Outline 3d SOT617-3
应用说明 (5)
名称/描述修改日期
AES encryption and decryption software on LPC microcontrollers (REV 1.1) ZIP (174.0 kB) AN1124117 Mar 2014
In-Application Programming for the LPC11Axx (REV 1.0) ZIP (979.0 kB) AN1138713 Aug 2013
I2C secondary boot loader (REV 1.0) ZIP (661.0 kB) AN1125809 Aug 2013
SPI secondary boot loader (REV 1.0) ZIP (638.0 kB) AN1125722 Jul 2013
How to implement the PMBus software stack (REV 1.0) ZIP (1.1 MB) AN1131822 Jul 2013
封装信息 (1)
名称/描述修改日期
DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm (REV 1.1) PDF (219.0 kB) SOT617-308 Jun 2016
订购信息
型号状态内核Clock speed [max] (MHz)DMIPS闪存 (kB)RAM (kB)EEPROM (kB)GPIO以太网USBUSB (speed)USB (type)LCDCANUARTDAC (bits)I²CSPIADC sample rateI²SADC channelsADC (bits)Comparators定时器Timer (bits)SCTimer / PWMRTCPWMPackage nameTemperature rangeTemperature sensorIOHSupply voltage [min] (V)Supply voltage [max] (V)Product categoryDemoboard
LPC11A13JHI33/201ActiveCortex-M050246228110128101416; 32111HVQFN32-40 °C to +105 °C11.83.6
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
LPC11A13JHI33/201SOT617-3Tray, Bakeable, Single in DrypackActiveLPC11A13JHI33/201E (9352 996 89551)Standard MarkingLPC11A13JHI33/201Always Pb-free33
AES encryption and decryption software on LPC microcontrollers LPC43S50FET256
In-Application Programming for the LPC11Axx LPC11A14JBD48
I2C secondary boot loader LPC1788FET208
SPI secondary boot loader LPC1788FET208
How to implement the PMBus software stack LPC43S50FET256
SOT617-3 LPC11U35FHI33
OL2381AHN
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