LPC18Sxx：Industry's highest Cortex-M3 performance, high-speed connectivity, advanced peripherals, and security options

Full range of high-speed connectiviy, timing and analog features combined with security features for code and data protection, including AES encryption, OTP key storage, and true random number generation.

特性和优势
    • Core: Industry's fastest,180 MHz, 32-bit ARM Cortex-M3
    • Memories and memory expansion
      • Up to 1 MB Flash
      • Up to 200 kB RAM
      • SPI Flash interface (SPIFI)
      • 8/16/32-bit external memory controller (EMC)
    • Up to 1 MB Flash
    • Up to 200 kB RAM
    • SPI Flash interface (SPIFI)
    • 8/16/32-bit external memory controller (EMC)
    • Security features
      • AES-128 encryption engine
      • True random number generator (TRNG)
      • OTP key storage
      • Code read protection (CRP)
    • AES-128 encryption engine
    • True random number generator (TRNG)
    • OTP key storage
    • Code read protection (CRP)
    • High-speed connectivity
      • Hi-Speed USB 2.0 interface, with on-chip Hi-Speed PHY and Hi-Speed USB 2.0 with ULPI interface
      • Dual CAN 2.0
      • 10/100 Ethernet
      • Graphic LCD up to 1024 x 768 pixel resolution
    • Hi-Speed USB 2.0 interface, with on-chip Hi-Speed PHY and Hi-Speed USB 2.0 with ULPI interface
    • Dual CAN 2.0
    • 10/100 Ethernet
    • Graphic LCD up to 1024 x 768 pixel resolution
    • SCTimer/PWM
    • 8-channel GPDMA controller
    • Analog
      • Two 8-channel, 10-bit, 400 ksps ADCs
      • One 10-bit DAC
    • Two 8-channel, 10-bit, 400 ksps ADCs
    • One 10-bit DAC
    • Basic serial connectivity
      • Two Fast-mode I²C
      • Three SPI, four UARTs
      • Smart card interface
    • Two Fast-mode I²C
    • Three SPI, four UARTs
    • Smart card interface
    • Audio support
      • Two I²S
      • Audio PLL
    • Two I²S
    • Audio PLL
    • Temperature rang
      • -40 to +85 °C (Flashless)
      • -40 to +105 °C (Flash)
    • -40 to +85 °C (Flashless)
    • -40 to +105 °C (Flash)
    • Pin-compatible with LPC4300 Series microcontrollers
产品图片
演示板
OM13076
OM13076
关键参数
型号CoreClock speed [max] (MHz)DMIPSFlash (kB)RAM (kB)EEPROM (kB)SecurityGPIOEthernetUSBUSB (speed)USB (type)LCDCANUARTI²CSPIADC channelsADC (bits)DAC (bits)TimersTimer (bits)SCTimer / PWMPWMPackage nameTemperature rangeSupply voltage [min] (V)Supply voltage [max] (V)Product statusDemoboard
LPC18S10FBD144Cortex-M318022501360Y83000242228101043216LQFP144-40 °C to +85 °C2.43.6Production
LPC18S10FET100Cortex-M318022501360Y49000242224101043216TFBGA100-40 °C to +85 °C2.43.6Production
LPC18S30FBD144Cortex-M318022502000Y8312HS (2x)host/device0242228101043216LQFP144-40 °C to +85 °C2.43.6Production
LPC18S30FET100Cortex-M318022502000Y4912HS (2x)host/device0242224101043216TFBGA100-40 °C to +85 °C2.43.6Production
LPC18S30FET256Cortex-M318022502000Y16412HS (2x)host/device0242228101043216LBGA256-40 °C to +85 °C2.43.6Production
LPC18S37JBD144Cortex-M3180225013616Y8312HS (2x)host/device0242228101043216LQFP144-40 °C to +105 °C2.43.6ProductionOM13076
LPC18S37JET100Cortex-M3180225020016Y4912HS (2x)host/device0242224101043216TFBGA100-40 °C to +105 °C2.43.6ProductionOM13076
LPC18S50FET180Cortex-M318022502000Y11812HS (2x)host/device1242228101043216TFBGA180-40 °C to +85 °C2.43.6Production
LPC18S50FET256Cortex-M318022502000Y16412HS (2x)host/device1242228101043216LBGA256-40 °C to +85 °C2.43.6Production
LPC18S57JBD208Cortex-M3180225013616Y14212HS (2x)host/device0242228101043216LQFP208-40 °C to +105 °C2.43.6Production
LPC18S57JET256Cortex-M3180225013616Y16412HS (2x)host/device0242228101043216LBGA256-40 °C to +105 °C2.43.6Production
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
LPC18S10FET100
TFBGA100
(SOT926-1)		sot926-1_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC18S10FET100E( 9353 041 77551 )
LPC18S30FBD144
LQFP144
(SOT486-1)		sot486-1_posot486-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE		Tray, Bakeable, Single in Drypack量产Standard MarkingLPC18S30FBD144E( 9353 059 02551 )
LPC18S30FET100
TFBGA100
(SOT926-1)		sot926-1_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC18S30FET100E( 9353 059 07551 )
LPC18S37JBD144
LQFP144
(SOT486-1)		sot486-1_posot486-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE		Tray, Bakeable, Single in Drypack量产Standard MarkingLPC18S37JBD144E( 9353 058 59551 )
LPC18S37JET100
TFBGA100
(SOT926-1)		sot926-1_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC18S37JET100E( 9353 059 08551 )
LPC18S50FET180
TFBGA180
(SOT570-3)		sot570-3_posot570-3_frTray, Bakeable, Single in Drypack量产Standard MarkingLPC18S50FET180E( 9353 059 09551 )
LPC18S50FET256
LBGA256
(SOT740-2)		sot740-2_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC18S50FET256,551( 9352 962 82551 )
LPC18S57JBD208
LQFP208
(SOT459-1)		sot459-1_posot459-1_fr
HTQFP-HLQFP-LQFP-MSQFP-WAVE		Tray, Bakeable, Single in Drypack量产Standard MarkingLPC18S57JBD208E( 9353 059 18551 )
LPC18S57JET256
LBGA256
(SOT740-2)		sot740-2_poTray, Bakeable, Single in Drypack量产Standard MarkingLPC18S57JET256E( 9352 998 02551 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
LPC18S10FET100LPC18S10FET100EAlways Pb-free33
LPC18S30FBD144LPC18S30FBD144EAlways Pb-freeNA3
LPC18S30FET100LPC18S30FET100EAlways Pb-freeNA3
LPC18S37JBD144LPC18S37JBD144EAlways Pb-free33
LPC18S37JET100LPC18S37JET100EAlways Pb-freeNA3
LPC18S50FET180LPC18S50FET180EAlways Pb-freeNA3
LPC18S50FET256LPC18S50FET256,551Always Pb-freeNA3
LPC18S57JBD208LPC18S57JBD208EAlways Pb-free33
LPC18S57JET256LPC18S57JET256EAlways Pb-freeNA3
文档资料
档案名称标题类型格式日期
LPC18S50_30_10 (中文)32-bit ARM Cortex-M3 flashless MCU with security features; up to 200 kB SRAM; Ethernet, two HS USB, LCD, EMC, AESData sheetpdf2015-02-23
LPC18S5X_S3X (中文)32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC, AES engineData sheetpdf2015-02-23
ES_LPC18S5X_S3X_FLASHErrata sheet LPC18S5x, LPC18S3x, flash-based devicesErrata sheetpdf2015-02-23
ES_LPC18SX0Errata sheet LPC18S50, LPC18S30, LPC18S10Errata sheetpdf2015-02-24
75017637NXP 180 MHz Cortex-M3 32-bit MCUs LPC18Sxx: Microcontrollers with integrated security to protect code and dataLeafletpdf2015-02-24
sot486-1_poplastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mmOutline drawingpdf2009-10-08
sot486-1_frFootprint for reflow soldering SOT486-1Reflow solderingpdf2009-10-08
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
sot570-3_pothin fine-pitch ball grid array package; 180 ballsOutline drawingpdf2010-04-28
sot570-3_frFootprint for reflow soldering SOT570-3Reflow solderingpdf2009-10-08
sot926-1_poplastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mmOutline drawingpdf2005-12-21
sot740-2_poplastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mmOutline drawingpdf2005-08-03
sot459-1_poplastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mmOutline drawingpdf2009-10-08
HTQFP-HLQFP-LQFP-MSQFP-WAVEFootprint for wave solderingWave solderingpdf2009-10-08
sot459-1_frFootprint for reflow soldering SOT459-1Reflow solderingpdf2009-10-08
订购信息
型号订购码 (12NC)可订购的器件编号
LPC18S10FET1009353 041 77551LPC18S10FET100E
LPC18S30FBD1449353 059 02551LPC18S30FBD144E
LPC18S30FET1009353 059 07551LPC18S30FET100E
LPC18S37JBD1449353 058 59551LPC18S37JBD144E
LPC18S37JET1009353 059 08551LPC18S37JET100E
LPC18S50FET1809353 059 09551LPC18S50FET180E
LPC18S50FET2569352 962 82551LPC18S50FET256,551
LPC18S57JBD2089353 059 18551LPC18S57JBD208E
LPC18S57JET2569352 998 02551LPC18S57JET256E
32-bit ARM Cortex-M3 flashless MCU with security features; up to 200 kB SRAM; Ethernet, two HS USB, LCD, EMC, AES LPC18S50FET256
32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC, AES engine LPC18S57JET256
Errata sheet LPC18S5x, LPC18S3x, flash-based devices LPC18S57JET256
Errata sheet LPC18S50, LPC18S30, LPC18S10 LPC18S50FET256
NXP 180 MHz Cortex-M3 32-bit MCUs LPC18Sxx: Microcontrollers with integrated security to protect code and data LPC18SXX
plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm LPC2929FBD144
Footprint for reflow soldering SOT486-1 LPC2929FBD144
thin fine-pitch ball grid array package; 180 balls LPC3143FET180
Footprint for reflow soldering SOT570-3 LPC3143FET180
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm LPC2368FET100
plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm LPC43S70FET256
plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm LPC2939FBD208
HTQFP-HLQFP-LQFP-MSQFP-WAVE LPC54114J256BD64
Footprint for reflow soldering SOT459-1 LPC2939FBD208
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