MC33662: LIN2.1 / SAEJ2602-2，LIN物理层 _ BDTIC 中国领先电子元器件代理商

MC33662: LIN2.1 / SAEJ2602-2，LIN物理层

恩智浦MC33662是一个专门用于汽车LIN子总线应用的物理层组件。

特性

工作电压范围为7.0至18 V DC，27 V DC时可正常工作，负载突降时可承受40 V电压
符合LIN协议规范1.3、2.0、2.1和SAEJ2602-2
主动总线波形整形，具有出色的辐射排放性能
在LIN总线上维持15.0 kV的最低ESD (IEC61000-4-2)，唤醒引脚上为20 kV，VSUP引脚上为25 kV
非常高的抗电磁干扰性能
睡眠模式下保持低待机电流
过热保护
通过RXD引脚实现本地和远程唤醒功能
通过RXD引脚实现快速波特率选择
5.0 V和3.3 V兼容数字输入，无需外部组件

NXP^® MC33662 Internal Block Diagram

NXP^® MC33662 Product Image

推荐文档 (3)

名称/描述	类型	Modified Date
MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet (REV 7.0) PDF (585.6 kB) MC33662 [English]	数据手册
MC33662FS, LIN 2.1 / SAEJ2602-2, LIN Physical Layer (REV 3.0) PDF (125.5 kB) MC33662FS [English]	简介
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note (REV 3.0) PDF (3.3 MB) AN2409 [English]	应用说明

数据手册 (1)

名称/描述	Modified Date
MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet (REV 7.0) PDF (585.6 kB) MC33662 [English]	30 Jan 2014

应用说明 (1)

名称/描述	Modified Date
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note (REV 3.0) PDF (3.3 MB) AN2409 [English]	21 Oct 2014

用户指南 (1)

名称/描述	Modified Date
KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide (REV 1.0) PDF (1.0 MB) KT33662UG [English]	31 Aug 2011

简介 (1)

名称/描述	Modified Date
MC33662FS, LIN 2.1 / SAEJ2602-2, LIN Physical Layer (REV 3.0) PDF (125.5 kB) MC33662FS [English]	09 Sep 2011

推荐软件和工具

评估套件 - MC33662L，LIN2.1/SAEJ2602-2, LIN物理层评估/开发板与系统
评估套件 - MC33662J，LIN2.1/SAEJ2602-2，LIN物理层评估/开发板与系统

评估/开发板与系统

订购信息

型号	状态	状态	器件功能	预算报价（不含税）(CNY)	封装类型和焊端数	通信协议	数据传输速率 (Min) (kbps)	数据传输速率 (Max) (kbps)	数据传输速率 (Spec) (kbps)	负载供电电压 (Min) (V)	负载供电电压 (Max) (V)	供电电压 (Min-Max) (V)	接口和输入控制	工作环境温度 (Min-Max) (°C)	保护	诊断	其他特性-模拟	RoHS
MC33662BLEFR2	Active		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662BSEF	Active		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662BJEF	Active		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	10.4	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662BLEF	Active		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662BSEFR2	Active		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662BJEFR2	Active		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	10.4	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662JEFR2	Not Recommended for New Design		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	10.4	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662LEFR2	Not Recommended for New Design		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662LEF	Not Recommended for New Design		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662SEF	Not Recommended for New Design		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662SEFR2	Not Recommended for New Design		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	20	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]
MC33662JEF	Not Recommended for New Design		Comm Transceivers	1K @ CNY2.31	SOIC 8	LIN	10.4	100				7 to 18		-40 to 125	Overtemperature		Sleep Mode	[object Object]

封装环保信息

封装说明	Outline Version	包装	产品状态	部件编号	化学成分	RoHS / Pb Free中国RoHS查询	MSL	PPT (°C)
SOICN 8 3.94.91.75	98ASB42564B	MPQ - 98 RAILPOQ - 2450 BOX	Active	MC33662BJEF	MC33662BJEF.pdf		3	260
		MPQ - 2500 REELPOQ - 2500 BOX	Active	MC33662BJEFR2	MC33662BJEFR2.pdf		3	260
		MPQ - 98 RAILPOQ - 2450 BOX	Active	MC33662BLEF	MC33662BLEF.pdf		3	260
		MPQ - 2500 REELPOQ - 2500 BOX	Active	MC33662BLEFR2	MC33662BLEFR2.pdf		3	260
		MPQ - 98 RAILPOQ - 2450 BOX	Active	MC33662BSEF	MC33662BSEF.pdf		3	260
		MPQ - 2500 REELPOQ - 2500 BOX	Active	MC33662BSEFR2	MC33662BSEFR2.pdf		3	260
		MPQ - 98 RAILPOQ - 2450 BOX	Not Recommended for New Design	MC33662JEF	MC33662JEF.pdf		3	260
		MPQ - 2500 REELPOQ - 2500 BOX	Not Recommended for New Design	MC33662JEFR2	MC33662JEFR2.pdf		3	260
		MPQ - 98 RAILPOQ - 2450 BOX	Not Recommended for New Design	MC33662LEF	MC33662LEF.pdf		3	260
		MPQ - 2500 REELPOQ - 2500 BOX	Not Recommended for New Design	MC33662LEFR2	MC33662LEFR2.pdf		3	260
		MPQ - 98 RAILPOQ - 2450 BOX	Not Recommended for New Design	MC33662SEF	MC33662SEF.pdf		3	260
		MPQ - 2500 REELPOQ - 2500 BOX	Not Recommended for New Design	MC33662SEFR2	MC33662SEFR2.pdf		3	260

MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet MC33662

AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note mc33797

KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide MC33662

MC33662FS, LIN 2.1 / SAEJ2602-2, LIN Physical Layer MC33662

评估套件 - MC33662L，LIN2.1/SAEJ2602-2, LIN物理层 MC33662

评估套件 - MC33662J，LIN2.1/SAEJ2602-2，LIN物理层 MC33662

98ASB42564B S08SH

MC33662BJEF.pdf MC33662

MC33662BJEFR2.pdf MC33662

MC33662BLEF.pdf MC33662

MC33662BLEFR2.pdf MC33662

MC33662BSEF.pdf MC33662

MC33662BSEFR2.pdf MC33662

MC33662JEF.pdf MC33662

MC33662JEFR2.pdf MC33662

MC33662LEF.pdf MC33662

MC33662LEFR2.pdf MC33662

MC33662SEF.pdf MC33662

MC33662SEFR2.pdf MC33662

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