MMBZ27VCL: 用于瞬态过压抑制的双ESD保护二极管
单向双静电放电(ESD)保护二极管采用共阴极配置，配以SOT23 (TO-236AB)小型表面贴装设备(SMD)塑料封装。该器件可为最多两条信号线提供ESD和瞬态过压保护。
MMBZ27VCL: 产品结构框图
MMBZ27VCL: 应用结构框图
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Double ESD protection diodes for transient overvoltage suppression (REV 1.0) PDF (80.0 kB) MMBZXVCL_MMBZXVDL_SER [English] | 03 Sep 2008 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| MMBZ27VCL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) MMBZ27VCL [English] | 31 Jan 2015 |
| MMBZ27VCL NXP Product Quality (REV 1.2) PDF (74.0 kB) MMBZ27VCL_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- MMBZ27VCL SPICE model (REV 1.4) prm MMBZ27VCL_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | PPPM @10/1000 µs [max] (W) | Configuration | No of protected lines | VRWM (V) | VBR [min] (V) | VBR [typ] (V) | VBR [max] (V) | IRM [max] (µA) | Vcl @ IPPM 10/1000 µs [max] (V) | IPPM @10/1000 µs [max] (W) | IPPM @10/1000 µs [max] (A) | VESD IEC61000-4-2 (kV) | Tj [max] (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MMBZ27VCL | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 40 | Unidirectional | 2 | 22 | 25.65 | 27 | 28.35 | 0.005 | 38 | 1 | 1 | 30 | 150 |
| MMBZ27VCL/DG | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 40 | Unidirectional | 2 | 22 | 25.65 | 27 | 28.35 | 0.005 | 38 | 1 | 30 | 150 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MMBZ27VCL | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | MMBZ27VCL,235 (9340 618 13235) | %ME | MMBZ27VCL |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | MMBZ27VCL,215 (9340 618 13215) | %ME | MMBZ27VCL | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- MMBZ27VCL NXP® Product Reliability mmbz27vcl
- MMBZ27VCL NXP Product Quality mmbz27vcl
- MMBZ27VCL SPICE model MMBZXVCL_MMBZXVDL_SERIES
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- TL431_FAMILY
- PMBFJ309
