MMG3006NT1: 400-2400 MHz,17.5 dB,33 dBm InGaP HBT GPA

特性
  • 频率:400-2400 MHz
  • P1dB:33 dBm @ 900 MHz
  • 小信号增益:17.5 dB @ 900 MHz
  • 输出三阶交调点:49 dBm @ 900 MHz
  • 5 V单电源
  • 内部输入预匹配至50 Ohms
  • 符合RoHS规范
  • 采用盘卷包装。T1后缀 = 1000个,12 mm卷带宽度,13英寸卷盘。
24-Pin QFN 4 x 4 Package Image
数据手册 (1)
名称/描述Modified Date
MMG3006NT1 400-2400 MHz, 17.5 dB, 33 dBm InGaP HBT GPA - Data Sheet (REV 5) PDF (497.0 kB) MMG3006NT1 [English]26 Sep 2014
应用说明 (3)
名称/描述Modified Date
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN1955 [English]29 Apr 2014
General Purpose Amplifier and MMIC Biasing (REV 3) PDF (164.3 kB) AN3100 [English]30 Mar 2011
PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 (REV 0) PDF (632.0 kB) AN3778 [English]26 Feb 2010
简介 (1)
名称/描述Modified Date
General Purpose Amplifiers Fact Sheet (REV 2) PDF (157.1 kB) RFGPAFS [English]30 Dec 2014
手册 (1)
名称/描述Modified Date
RF GaAs Solutions (REV 1) PDF (416.3 kB) BR1609 [English]21 Dec 2011
选型工具指南 (1)
名称/描述Modified Date
RF Products Selector Guide (REV 43) PDF (3.8 MB) SG46 [English]26 May 2016
快速参考指南 (1)
名称/描述Modified Date
RF MMIC and GPA Cross Reference (REV 2) PDF (1.1 MB) MMICGPAQRG [English]21 Dec 2011
封装信息 (1)
名称/描述Modified Date
98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins (REV C) PDF (58.1 kB) 98ASA10761D [English]21 Mar 2016
印刷电路板
订购信息
型号状态状态Frequency Min (Min) (MHz)Frequency Max (Max) (MHz)模具技术供电电压 (Min-Max) (V)电源电流 (Typ) (mA)功率增益 (Typ) (dB) @ f (MHz)P1dB (Typ) (dBm)输出功率 (Typ) (dBm) @ f (MHz)三阶交调截取点 (Typ) (dBm)噪声系数 (Typ) (dB) @ f (MHz)热阻 (Spec)(°C/W)类型
MMG3006NT1Active4002400InGaP HBT5 to 585017.5 @ 9003333 @ 900496.6 @ 9007.8A
封装环保信息
封装说明Outline Version包装产品状态部件编号化学成分RoHS / Pb Free中国RoHS查询MSLPPT (°C)
QFN 16 4*4*.9.P0.6598ASA10761DMPQ - 1000 REELPOQ - 5000 BOXActiveMMG3006NT1MMG3006NT1.pdf1260
MMG3006NT1 400-2400 MHz, 17.5 dB, 33 dBm InGaP HBT GPA - Data Sheet MMG3006NT1
MMG3006NT1 400-2400 MHz, 17.5 dB, 33 dBm InGaP HBT GPA - Data Sheet MMG3006NT1
MMG3006NT1.pdf MMG3006NT1
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
General Purpose Amplifier and MMIC Biasing MMA25312B
PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 MMG3006NT1
General Purpose Amplifiers Fact Sheet MMG3H21NT1
RF GaAs Solutions MMZ25332B
RF Products Selector Guide MMT20303H
RF MMIC and GPA Cross Reference MMZ25332B
MMG3006NT1 CAD DXF File MMG3006NT1
98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins MMG3006NT1
MMG3006NT1.pdf MMG3006NT1