OM13491：Surface Mount to DIP Evaluation Board OM13491 _ BDTIC 中国领先电子元器件代理商

OM13491：Surface Mount to DIP Evaluation Board OM13491

The OM13491 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13491 supports the following packages: SO8 (SOT96), VSSOP8 (SOT765), XQFN8 (SOT902), HWSON8 x 2 (SOT1069), MSOP8 x 2 (SOT505).

特性

Easy connection to small surface mount packages
Allows evaluation of device that are only available in surface mount packages
100 mil center headers emulate DIP package for easy bread boarding
Eliminates costly sockets and custom printed circuit boards
Expand the kit with add-on I²C daughter cards

产品图片

文档资料

档案名称	标题	类型	格式	日期
UM10754	OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board	User manual	pdf	2013-10-30

订购信息

型号	订购码 (12NC)	可订购的器件编号	产品状态
OM13491	9353 029 49598	OM13491UL	Active

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OM13491

OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board nvt4556

OM13491：Surface Mount to DIP Evaluation Board OM13491

特性

产品图片

文档资料

订购信息

相关产品

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