PBLS6003D: 60 V PNP BISS负载开关

PNP低VCEsat突破性小信号(BISS)晶体管和NPN配电阻晶体管(RET),采用SOT457 (SC-74)小型表面贴装器件(SMD)塑料封装。

PBLS6003D: 产品结构框图
PBLS6003D: 应用结构框图
SOT457
数据手册 (1)
名称/描述Modified Date
60 V PNP BISS loadswitch (REV 2.0) PDF (138.0 kB) PBLS6003D [English]24 Sep 2009
应用说明 (1)
名称/描述Modified Date
Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board (REV 1.0) PDF (260.0 kB) AN10361 [English]20 Jun 2005
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English]30 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBLS6003D NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBLS6003D_1 [English]31 Jan 2015
PBLS6003D NXP Product Quality (REV 1.2) PDF (74.0 kB) PBLS6003D_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]03 Jun 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polarityPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)VCEsat [max] (trans 2) (mV)hFE [min]hFE [typ]RCEsat@IC [max]; IC/IB =10 [typ] (mOhm)fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)
PBLS6003DActiveSOT457TSOP62.9 x 1.5 x 1NPN/PNP60050-34030255150-150
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBLS6003DSOT457Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBLS6003D,115 (9340 592 66115)F3PBLS6003DAlways Pb-free153.00.711.41E911
60 V PNP BISS loadswitch PBLS6003D
Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board BAT754S
PBLS6003D NXP® Product Reliability PBLS6003D
PBLS6003D NXP Product Quality PBLS6003D
MAR_SOT457 Topmark 74LVC2G17_Q100
PBLS6003D_NPN SPICE model PBLS6003D
plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
PESDXS5UD_SERIES
PBLS6005D
SSL5021_SSL5031