PBSS2515M: 15 V、0.5 A NPN低VCEsat (BISS)晶体管

低VCEsat NPN晶体管,采用SOT883无引脚超小型塑料封装。PNP补充:PBSS3515M。

PBSS2515M: 产品结构框图
SOT883
数据手册 (1)
名称/描述Modified Date
15 V, 0.5 A NPN low VCEsat (BISS) transistor (REV 3.0) PDF (144.0 kB) PBSS2515M [English]15 Sep 2003
应用说明 (2)
名称/描述Modified Date
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English]04 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
选型工具指南 (1)
名称/描述Modified Date
Application guide; Portable devices and mobile handsets (REV 2.0) PDF (15.4 MB) 75017090 [English]13 Mar 2012
封装信息 (1)
名称/描述Modified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS2515M NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS2515M_1 [English]31 Jan 2015
PBSS2515M NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS2515M_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)fT [min] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS2515MActiveSOT883DFN1006-31.0 x 0.6 x 0.5NPN1250150.51200420250360250500
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS2515MSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePBSS2515M,315 (9340 571 45315)S2PBSS2515MAlways Pb-free153.00.711.41E911
15 V, 0.5 A NPN low VCEsat (BISS) transistor PBSS2515M
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
Application guide; Portable devices and mobile handsets pesd24vs1ul
PBSS2515M NXP® Product Reliability PBSS2515M
PBSS2515M NXP Product Quality PBSS2515M
PBSS2515M SPICE model PBSS2515M
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PBSS2540M
PMZ950UPE