PBSS302NZ: 20 V、5.8 A NPN低VCEsat (BISS)晶体管

NPN低VCEsat突破性小信号(BISS)晶体管,采用SOT223 (SC-73)小型表面贴装器件(SMD)塑料封装。

PNP补充:PBSS302PZ。

PBSS302NZ: 产品结构框图
PBSS302NZ: 应用结构框图
SOT223
数据手册 (1)
名称/描述Modified Date
20 V, 5.8 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (164.0 kB) PBSS302NZ [English]08 Dec 2009
应用说明 (1)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS302NZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS302NZ_1 [English]31 Jan 2015
PBSS302NZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS302NZ_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polarityPtot [max] (mW)number of transistorsVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS302NZActiveSOT223SC-736.5 x 3.5 x 1.65NPN7001205.811.63005701400.030.03825043
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS302NZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActivePBSS302NZ,135 (9340 590 43135)S302NZPBSS302NZAlways Pb-free153.00.711.41E911
20 V, 5.8 A NPN low VCEsat (BISS) transistor PBSS302NZ
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS302NZ NXP® Product Reliability PBSS302NZ
PBSS302NZ NXP Product Quality PBSS302NZ
PBSS302NZ SPICE model PBSS302NZ
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
PBHV9115Z
BLT81