PBSS306PX: 100 V、3.7 A PNP低V_CEsat (BISS)晶体管

PNP低VCEsat突破性小信号(BISS)晶体管,采用SOT89 (SC-62/TO-243)小型和扁平引脚表面贴装器件(SMD)塑料封装。

NPN补充:PBSS306NX。

PBSS306PX: 产品结构框图
PBSS306PX: 应用结构框图
SOT089
数据手册 (1)
名称/描述Modified Date
100 V, 3.7 A PNP low V_CEsat (BISS) transistor (REV 2.1) PDF (207.0 kB) PBSS306PX [English]28 Jan 2010
应用说明 (1)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS306PX NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS306PX_1 [English]31 Jan 2015
PBSS306PX NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS306PX_NXP_PRODUCT_QUALITY [English]31 Jan 2015
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS306PXActiveSOT89SOT894.5 x 2.5 x 1.5PNP1600-100-3.7-7.420030010052-6075
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS306PXSOT89Reel 7" Q1/T1ActivePBSS306PX,115 (9340 590 19115)%5NPBSS306PXAlways Pb-free153.00.711.41E911
100 V, 3.7 A PNP low V_CEsat (BISS) transistor PBSS306PX
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS306PX NXP® Product Reliability PBSS306PX
PBSS306PX NXP Product Quality PBSS306PX
PBSS306PX SPICE model PBSS306PX
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
PBSS9110X
BFU590Q