PBSS4032NX: 30 V,4.7 A NPN低VCEsat (BISS)晶体管

NPN低VCEsat突破性小信号(BISS)晶体管,采用中等功率和扁平引脚SOT89 (SC-62)表面贴装器件(SMD)塑料封装。

PNP补充产品:PBSS4032PX。

SOT089
数据手册 (1)
名称/描述Modified Date
30 V, 4.7 A NPN low V_CEsat (BISS) transistor (REV 1.0) PDF (192.0 kB) PBSS4032NX [English]06 Apr 2010
应用说明 (3)
名称/描述Modified Date
Low VCEsat transistors in medium power loadswitch applications (REV 2.0) PDF (252.0 kB) AN10909 [English]14 Mar 2013
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English]04 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS4032NX NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4032NX_1 [English]31 Jan 2015
PBSS4032NX NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4032NX_NXP_PRODUCT_QUALITY [English]31 Jan 2015
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS4032NXActiveSOT89SOT894.5 x 2.5 x 1.5NPN1600304.7103005001454537562.5
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS4032NXSOT89Reel 7" Q1/T1ActivePBSS4032NX,115 (9340 634 06115)%6HPBSS4032NXAlways Pb-free153.00.711.41E911
30 V, 4.7 A NPN low V_CEsat (BISS) transistor PBSS4032NX
Low VCEsat transistors in medium power loadswitch applications PBSS4041SPN
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS4032NX NXP® Product Reliability PBSS4032NX
PBSS4032NX NXP Product Quality PBSS4032NX
PBSS4032NX SPICE model PBSS4032NX
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
BFU590Q