PBSS4330PAS: 30 V、3 A NPN低VCEsat (BISS)晶体管

NPN低VCEsat突破性小信号(BISS)晶体管,采用DFN2020D-3 (SOT1061D)无引脚超薄小型表面贴装器件(SMD)塑料封装,具有中等功率能力和可见且可焊侧焊盘。

PNP补充:PBSS5330PAS

sot1061d_3d
数据手册 (1)
名称/描述Modified Date
30 V, 3 A NPN low VCEsat (BISS) transistor (REV 1.0) PDF (248.0 kB) PBSS4330PAS [English]11 Sep 2014
封装信息 (1)
名称/描述Modified Date
DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D [English]08 Feb 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS4330PAS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4330PAS_1 [English]31 Jan 2015
PBSS4330PAS NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4330PAS_NXP_PRODUCT_QUALITY [English]31 Jan 2015
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)RCEsat [max] (mΩ)VCEsat [max] (mV)
PBSS4330PASActiveSOT1061DDFN2020D-32 x 2 x 0.65NPN12500303530046510021075100300
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS4330PASSOT1061DReel 7" Q1/T1ActivePBSS4330PASX (9340 681 06115)E1PBSS4330PASAlways Pb-free153.00.711.41E911
30 V, 3 A NPN low VCEsat (BISS) transistor PBSS4330PAS
PBSS4330PAS NXP® Product Reliability PBSS4330PAS
PBSS4330PAS NXP Product Quality PBSS4330PAS
PBSS4330PAS SPICE model PBSS4330PAS
DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm BC56PAS
DFN2020D_3_SCHOTTKY_RECTIFIER_SERIES