PBSS4350SPN: 50 V,2.7 A NPN/PNP低VCEsat (BISS)晶体管

NPN/PNP双低VCEsat突破性小信号(BISS)晶体管,采用中等功率表面贴装器件(SMD)塑料封装。

PNP/PNP补充产品:PBSS5350SS

PBSS4350SPN: 产品结构框图
PBSS4350SPN: 应用结构框图
sot096-1_3d
数据手册 (1)
名称/描述Modified Date
50 V, 2.7 A NPN/PNP low V_CEsat (BISS) transistor (REV 1.0) PDF (133.0 kB) PBSS4350SPN [English]12 Oct 2016
应用说明 (1)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-1 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (222.0 kB) SOT96-1_115 [English]23 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS4350SPN NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4350SPN_1 [English]31 Jan 2015
PBSS4350SPN NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4350SPN_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polarityPtot [max] (mW)PolarityVCEO [max] (V)number of transistorsIC [max] (A)ICM [max] (A)hFE [min]VCEsat [max] (NPN) (mV)hFE [typ]VCEsat [max] (PNP) (mV)fT [typ] (MHz)RCEsat@IC [max]; IC/IB =10 [typ] (mΩ)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS4350SPNActiveSOT96-1SO84.9 x 3.9 x 1.75NPN/PNP750NPN/PNP5022.75300340500-370140.000000000000010.090.095340130
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS4350SPNSOT96-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 7" Q1/T1ActivePBSS4350SPN,115 (9340 610 33115)4350SPNPBSS4350SPNAlways Pb-free153.00.711.41E911
50 V, 2.7 A NPN/PNP low V_CEsat (BISS) transistor PBSS4350SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS4350SPN NXP® Product Reliability PBSS4350SPN
PBSS4350SPN NXP Product Quality PBSS4350SPN
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
PBSS4350SPN SPICE model PBSS4350SPN
plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
Tape reel SMD; standard product orientation 12NC ending 115 PBSS5350SS
PBSS5350SS
PBSS4350SPN
SA612A