PBSS4540Z: 40V低VCEsat NPN晶体管

NPN低VCEsat晶体管,采用SOT223塑料封装。

PNP补充:PBSS5540Z。

PBSS4540Z: 产品结构框图
SOT223
数据手册 (1)
名称/描述Modified Date
40 V low VCEsat NPN transistor (REV 3.0) PDF (147.0 kB) PBSS4540Z [English]14 Nov 2001
应用说明 (2)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS4540Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4540Z_1 [English]31 Jan 2015
PBSS4540Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4540Z_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS4540ZActiveSOT223SC-736.5 x 3.5 x 1.65NPN1135040510300500701304235571
PBSS4540Z/DGNo Longer ManufacturedSOT223SC-736.5 x 3.5 x 1.65NPN13504051030050013042355
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS4540ZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBSS4540Z,115 (9340 554 95115)PB4540PBSS4540Zweek 34, 2003153.00.711.41E911
40 V low VCEsat NPN transistor PBSS4540Z
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
PBSS4540Z NXP® Product Reliability PBSS4540Z
PBSS4540Z NXP Product Quality PBSS4540Z
PBSS4540Z SPICE model PBSS4540Z
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
PBSS4540Z
BLT81