PBSS4612PA: 12 V, 6 A NPN low V_CEsat (BISS) transistor

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

PNP complement: PBSS5612PA.

Outline 3d SOT1061
数据手册 (1)
名称/描述Modified Date
12 V, 6 A NPN low V_CEsat (BISS) transistor (REV 1.0) PDF (167.0 kB) PBSS4612PA [English]19 May 2010
应用说明 (2)
名称/描述Modified Date
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English]04 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
可靠性与质量信息 (1)
名称/描述Modified Date
PBSS4612PA NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4612PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)RCEsat [max] (mΩ)VCEsat [max] (mV)
PBSS4612PAActiveSOT1061DFN2020-32 x 2 x 0.65NPN12100126728044050803346275
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS4612PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActivePBSS4612PA,115 (9340 634 89115)A5PBSS4612PAAlways Pb-free153.00.711.41E911
12 V, 6 A NPN low V_CEsat (BISS) transistor PBSS4612PA
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS4612PA NXP Product Quality PBSS4612PA
PBSS4612PA SPICE model PBSS4612PA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES