PBSS8110Y: 100 V、1 A NPN低VCEsat (BISS)晶体管

NPN低VCEsat晶体管,采用SOT363 (SC-88)塑料封装。

PBSS8110Y: 产品结构框图
PBSS8110Y: 应用结构框图
SOT363
数据手册 (1)
名称/描述Modified Date
100 V, 1 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (177.0 kB) PBSS8110Y [English]11 Dec 2009
应用说明 (2)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English]15 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS8110Y NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS8110Y_1 [English]31 Jan 2015
PBSS8110Y NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS8110Y_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS8110YActiveSOT363TSSOP62 x 1.25 x 0.95NPN129010013150100160200200
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS8110YSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBSS8110Y,115 (9340 579 82115)81%PBSS8110YAlways Pb-free153.00.711.41E911
100 V, 1 A NPN low VCEsat (BISS) transistor PBSS8110Y
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
PBSS8110Y NXP® Product Reliability PBSS8110Y
PBSS8110Y NXP Product Quality PBSS8110Y
MAR_SOT363 Topmark BSS84AKS
PBSS8110Y SPICE model PBSS8110Y
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
PBSS8110Y
PBSS8110Y
BFU520Y