PEMD10: NPN/PNP配电阻晶体管;R1 = 2.2 kΩ,R2 = 47 kΩ

NPN/PNP配电阻晶体管(RET),采用表面贴装器件(SMD)塑料封装。

PEMD10: 产品结构框图
SOT666
数据手册 (1)
名称/描述Modified Date
NPN/PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 47kΩ (REV 6.0) PDF (922.0 kB) PEMD10_PUMD10 [English]10 Jan 2012
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English]29 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PEMD10 NXP Product Quality (REV 1.2) PDF (74.0 kB) PEMD10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PEMD10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PEMD10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)channel typePtot (mW)R2 (typ) (kΩ)IC [max] (mA)R1 (typ) (kΩ)VCEO (V)
PEMD10ActiveSOT666SOT6661.6 x 1.2 x 0.55NPN/PNP300471002.250
PEMD10/DGNo Longer ManufacturedSOT666SOT6661.6 x 1.2 x 0.55NPN/PNP300471002.250
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PEMD10SOT666Reflow_Soldering_ProfileReel 7" Q1/T1ActivePEMD10,115 (9340 568 58115)D1PEMD10Always Pb-free153.00.711.41E911
NPN/PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 47kΩ PUMD10
PEMD10 NXP Product Quality PEMD10
PEMD10 NXP® Product Reliability PEMD10
Letter Symbols - Transistors; General PEMD16
PEMD10 SPICE model PEMD10_PUMD10
plastic surface-mounted package; 6 leads BSS84AKV
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
PEMD9_PUMD9
1PSXSB17